Grid Masking Structure for Packaging Trays Under Laser Processing

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Solution Overview

Problem

The existing methods for loading and unloading semiconductor packages in packaging trays are time-consuming and prone to causing thermal damage during laser processing, especially as package sizes decrease, leading to reduced productivity and potential damage to the packaging trays.

Innovation Solution

A masking device is installed on the packaging tray with a grid-shaped mask part comprising transverse and longitudinal masks to protect the tray from thermal damage during laser processing by blocking the laser beam from reaching the tray surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser processing is performed on chips in packaging trays without masking, then processing speed and productivity are improved, but thermal damage occurs to the packaging tray

Engineering Contradiction:

Improvelaser processing speedVSAvoidthermal damage to packaging tray

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The mask part is divided into multiple segments (first mask and second mask) arranged in a grid pattern, where each segment corresponds to a specific chip position. This segmentation allows the laser beam to be blocked only at necessary locations while maintaining processing efficiency across multiple chips simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The mask part acts as an intermediary component positioned between the laser beam source and the packaging tray. It selectively blocks the laser beam from reaching the packaging tray surface while allowing the laser to process the chips, thus preventing thermal damage to the tray without compromising processing capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If individual loading and unloading of semiconductor packages is performed, then damage to packages is reduced, but processing time increases significantly

Engineering Contradiction:

Improvepackage integrityVSAvoidloading and unloading time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

Multiple chips are processed simultaneously within a single packaging tray using the masking device, merging multiple individual processing operations into one collective operation. This eliminates the need for repeated loading and unloading cycles, significantly reducing processing time while maintaining package integrity through controlled laser application.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The masking device enables continuous laser processing across multiple chips in a single operation, maintaining continuous useful action without interruption for loading/unloading. The grid-shaped mask allows the laser beam to continuously process chips in rows and columns simultaneously, eliminating idle time between operations.

Inventive Principle:

Principle #20Continuity of useful action

3Ease of manufacture

If the chip is placed directly on the packaging tray, then setup is simple, but the packaging tray is exposed to laser heat and suffers thermal damage

Engineering Contradiction:

Improvesetup simplicityVSAvoidlaser heat exposure to tray

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The mask part is positioned locally between the laser beam and the packaging tray surface, providing heat protection only where needed (at the tray surface) while allowing the chips to remain in their original positions on the tray. This localized intervention maintains setup simplicity while preventing thermal damage to the tray.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The mask part is positioned in a vertical dimension between the laser beam source and the packaging tray, creating a spatial separation that blocks laser heat from reaching the tray while maintaining the horizontal positioning of chips on the tray. This dimensional approach preserves setup simplicity while adding protective functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient laser processing of chips without thermal damage to the packaging tray by effectively blocking the laser beam from the tray surface using a masking device with intersecting masks.

Implementation Method 1

a mask part (100) installed in a grid shape above a packaging tray (10) in which a mounting part (12) on which a chip (20) is mounted is provided to form a number of rows and columns to protect the packaging tray (10) from a heat source

Methodology Applied

Scientific EffectLaser beam blocking: Absorption (EM radiation)

Data Source

PatentUS20260076142A1Masking device for packaging tray

Publication Date: 2026.03.12 SSP INC(KR)

AI summary

Proposed is a masking device for a packaging tray, which enables laser processing of a chip without thermal damage to a packaging tray by installing the masking device on the packaging tray while the chip placed on the packaging tray is vertically raised by a heating block. The masking device may include a mask part installed in a grid shape above a packaging tray in which a mounting part on which a chip is mounted is provided to form a number of rows and columns to protect the packaging tray from a heat source.