Grid Array Package Self-Alignment for Fine-Pitch PCB Assembly
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Solution Overview
Problem
As component density increases and packaging sizes decrease in grid array-based integrated circuit components, the reduced pitch between connection points leaves minimal room for positioning errors during placement and soldering, leading to alignment issues during assembly.
Innovation Solution
The implementation of self-correcting alignment pins with tapered portions and corresponding self-correcting alignment receptacles on the connection pads allows for automatic alignment and correction of positioning errors during assembly, ensuring proper alignment of the grid array components with the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If component density is increased and packaging size is reduced, then component integration is improved, but positioning precision deteriorates due to minimal room for errors
Solution Approach 1:
The alignment pins are pre-positioned on the integrated circuit package at designated locations, and the receptacles are pre-formed on the substrate. During assembly, the pins automatically engage with the receptacles before final soldering, preliminarily establishing precise alignment and correcting any positioning errors that occur during placement.
Solution Approach 2:
The alignment pins and receptacles serve as intermediary alignment features between the integrated circuit package and the substrate. These intermediaries provide a mechanical reference system that mediates the alignment process, ensuring accurate positioning even when component density increases and packaging size decreases.
2Quantity of substance
If pitch between connection points is decreased, then component density is improved, but alignment tolerance is reduced leading to positioning errors
Solution Approach 1:
The alignment function is segmented from the connection points themselves. Instead of relying solely on the fine-pitch connection points for alignment, dedicated alignment pins and receptacles are provided as separate features. This segmentation allows the connection points to maintain fine pitch for high density while the alignment features provide robust positioning tolerance.
3Volume of moving object
If packaging size is reduced, then device compactness is improved, but alignment complexity increases due to tighter tolerances
Solution Approach 1:
The alignment pins and receptacles are designed to provide self-aligning functionality during assembly. The physical engagement between pins and receptacles automatically corrects positioning errors without requiring complex external alignment mechanisms or procedures, thereby reducing alignment complexity despite reduced packaging size.
Data Source
AI summary
A data storage device includes a substrate and one or more grid array integrated circuit packages. The grid array integrated circuit package includes at least one self-alignment pin having a tapered shape. The substrate includes one or more connection pads to receive the grid array integrated circuit packages. The connection pads include at least one self-alignment receptacle that receives the self-alignment pins such that the grid array integrated circuit packages maintain an alignment with an associated connection pad of the substrate.