Grid Sensor With Milled Metal Channels For Pressure Resistance
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Solution Overview
Problem
Existing grid sensors face challenges in manufacturing complexity and high costs due to issues with potting and pressure-tightness, especially at high pressures and temperatures, leading to durability and reliability concerns.
Innovation Solution
A grid sensor design featuring a sensor circuit board with non-conductive surface and milled channels for wire electrodes, lined with a thin metal layer and sealed with conductive compound, clamped between non-conductive sealing rings, reducing production complexity and enhancing pressure and temperature resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic casting resin is used to encapsulate the sensor circuit board, then pressure tightness and sealing are achieved, but temperature resistance is lost above 120°C and production complexity increases
Solution Approach 1:
The sensor is divided into two independent parts: the sensor circuit board assembly and the metal sensor body. The circuit board is sealed independently using laser welding of metal channels, while the metal body provides structural support and pressure resistance. This segmentation eliminates the need for temperature-limited organic casting resin.
Solution Approach 2:
The organic casting resin encapsulation process is replaced with a mechanical joining method (laser welding) to create pressure-tight seals. The metal channels are laser-welded to the circuit board, providing both mechanical strength and pressure tightness without temperature limitations.
2Reliability
If wire electrodes are routed through long distances in the sensor metal body, then pressure tightness is maintained, but production complexity and costs increase
Solution Approach 1:
Instead of routing wires through the metal body from the outside, the approach is inverted: metal channels are created on the circuit board itself, and wires are embedded directly into these channels. This eliminates long external routing paths and complex mechanical encapsulation.
Solution Approach 2:
The electrical connection function and the sealing function are merged into a single integrated structure. The metal channels serve both as electrical conductors and as pressure-tight seals, eliminating the need for separate routing paths and reducing production complexity.
3Reliability
If clamping force is applied to ensure pressure tightness, then sealing is improved, but contact between wire electrodes and metal structures may occur causing leaks
Solution Approach 1:
An electrically insulating layer is introduced as an intermediary between the wire electrodes and the metal sensor body. This thin insulation layer prevents electrical contact and potential leaks while allowing the clamping force to be transmitted for pressure tightness.
Solution Approach 2:
A thin insulating film or coating is applied to the metal channels or wire electrodes to provide electrical isolation. This thin film maintains the pressure-tight seal under clamping force while preventing harmful electrical contact between conductive elements.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The invention relates to a grid sensor by means of which the complexity of the production process and the installation and operating costs for the grid sensor can be significantly reduced and the service life and pressure and temperature stability of the grid sensor can be significantly increased compared to previous grid sensors. From the edge of the measurement cross section (2), channels (3) having a width of more than the diameter of the wire electrodes (6) and having a depth of less than half the thickness of the sensor board (1) extend in said sensor board, the channels (3) being clad with a metal layer (5), the wire electrodes (6) with both ends thereof being inserted in one of the opposite channels (3) at the periphery of the measurement cross section (2) and fixed in the channels (3) by means of a conductive sealing compound (8), the conductive sealing compound (8) in each channel (3) being flush with the upper side of the sensor board (1), and the sensor board (1) being clamped between two clamping plates (10).