Grid-Based Transfer Printing for Multi-Device Substrate Integration
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Solution Overview
Problem
The efficiency of transferring devices from a carrier substrate to another is low, as only a few devices are transferred per procedure, requiring multiple steps and inefficient use of space.
Innovation Solution
Devices are produced and transferred in a two-dimensional grid on the carrier substrate, with positions on the receiving substrate defined to match the grid, allowing for simultaneous transfer and efficient arrangement of multiple devices in predefined positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional transfer printing methods are used, then devices can be transferred from one carrier substrate to another, but only a few devices are transferred per procedure requiring multiple steps
Solution Approach 1:
The transfer process is segmented into distinct phases: release from donor substrate, transfer to intermediary stamp, and application to receiver substrate. This segmentation allows for systematic optimization of each phase and enables parallel processing of multiple devices through the use of grid-based positioning and arrayed stamps
Solution Approach 2:
An intermediary transfer stamp serves as a mediator between the donor carrier substrate and the receiver carrier substrate. This intermediary enables the decoupling of the release and application processes, allowing devices to be released from the donor, temporarily held on the stamp, and then transferred to the receiver in a controlled manner, thereby increasing transfer efficiency
2Productivity
If devices are transferred one by one or in small groups, then positioning can be controlled, but the use of carrier substrate area is inefficient
Solution Approach 1:
The transfer process transitions from linear or sequential device transfer to two-dimensional grid-based array transfer. Devices are arranged in grids on both donor and receiver substrates, and stamps are configured to transfer multiple devices simultaneously across the substrate area, dramatically improving space utilization and transfer efficiency
Solution Approach 2:
The carrier substrate area is segmented into a grid of positions, with each grid cell corresponding to a specific device location. This segmentation enables systematic addressing and transfer of devices at multiple positions simultaneously, optimizing the use of available substrate area
3Quantity of substance
If multiple transfer procedures are used to transfer more devices, then more devices can be transferred, but the process complexity increases
Solution Approach 1:
Multiple device transfers that would traditionally require separate procedures are merged into a single transfer operation. By using arrayed stamps with multiple contact points and grid-based positioning, the system combines multiple transfer actions into one coordinated procedure, reducing process complexity while increasing throughput
Solution Approach 2:
The transfer stamp is designed with multi-functionality to perform multiple transfer operations. A single stamp can transfer devices from multiple positions on the donor substrate to multiple positions on the receiver substrate, making the transfer system universal and reducing the need for multiple specialized transfer procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the transfer of a greater number of devices with minimal effort and space-saving, optimizing the use of carrier substrate area and facilitating the integration of devices with different properties.
Implementation Method 1
Some devices are brought into conformal contact with the surface of a stamp so that these devices can be released from the first semiconductor wafer by adhesion to the stamp
Implementation Method 2
the devices adhering to the stamp are brought into conformal contact with the new carrier substrate and fixed thereto
Data Source
AI summary
The transfer of devices or device components from a carrier substrate to a further carrier substrate or to a plurality of further carrier substrates can be performed with little effort (few transfer steps) to the at least one further carrier substrate. The method comprises producing first devices on the first carrier substrate in a two-dimensional grid. It comprises defining positions on the second carrier substrate on the basis of the two-dimensional grid for at least some of the first devices. It comprises releasing a plurality of the first devices from the first carrier substrate while maintaining the two-dimensional grid. Finally, the plurality of first devices are applied to the second carrier substrate in the defined positions while maintaining the two-dimensional grid or a multiple thereof in at least one of the two directions.