Grid Vacuum Channel Substrate Table for Uniform Wafer Clamping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate table systems are inadequate for handling larger semiconductor substrates, leading to irregular deformation and stress due to uneven suction forces, which can affect the yield of semiconductor fabrication processes.
Innovation Solution
A substrate table system with evenly distributed vacuum channels and gas supply channels, integrated with a pressure control module, to provide consistent vacuum clamping and controlled gas supply, ensuring uniform pressure and temperature distribution across the substrate, reducing deformation and improving process yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If substrate table systems are designed for larger substrates, then substrate size capacity is improved, but uniformity of suction force distribution deteriorates
Solution Approach 1:
The substrate table is segmented into multiple independent vacuum channels arranged in a grid pattern, allowing each channel to be controlled separately. This segmentation enables uniform suction force distribution across large substrate areas by independently adjusting vacuum levels in different regions, resolving the contradiction between increased table area and maintained suction uniformity.
Solution Approach 2:
The system implements local quality control by providing independent vacuum channel control for different regions of the substrate table. Each vacuum channel can be adjusted to provide locally optimized suction forces, ensuring uniform overall distribution while accommodating variations in substrate size and shape across the enlarged table area.
2Stability of the object's composition
If vacuum channels are evenly distributed, then suction force uniformity is improved, but device complexity increases
Solution Approach 1:
The vacuum system is segmented into multiple independent channels arranged in a grid pattern, where each channel can be controlled separately. This segmentation provides uniform suction force distribution while managing complexity through modular design, allowing systematic control of each segment rather than requiring complex integrated control.
Solution Approach 2:
The system incorporates dynamic control capabilities where vacuum levels in different channels can be independently adjusted based on real-time substrate positioning and processing requirements. This dynamic adaptation maintains suction uniformity while managing system complexity through programmable control rather than fixed mechanical configurations.
3Manufacturing precision
If pressure control module is integrated, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The integrated pressure control module incorporates feedback mechanisms that monitor vacuum levels and substrate positioning in real-time, automatically adjusting vacuum distribution to maintain optimal substrate flatness. This feedback control improves manufacturing precision while managing system complexity through automated closed-loop control rather than requiring manual intervention.
Solution Approach 2:
The system dynamically changes vacuum pressure parameters across different channels based on substrate position and processing requirements. By programmatically controlling pressure parameters rather than using fixed mechanical adjustments, the system achieves improved substrate flatness control while managing complexity through software-based parameter management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures consistent vacuum clamping and uniform gas distribution, reducing substrate deformation and improving the yield of semiconductor fabrication processes by maintaining substrate flatness and controlling pressure and temperature according to processing requirements.
Implementation Method 1
a plurality of vacuum channels provided in the burls to apply a vacuum to the substrate
Data Source
AI summary
A substrate table is provided. The substrate table includes a main body having a surface and a plurality of burls extending from the surface. The burls are configured to support a substrate on the main body. The substrate table further includes a number of vacuum channels provided in the burls to apply a vacuum to the substrate. The vacuum channels are distributed throughout the main body and arranged in a grid pattern.