Grind Spindle Alignment via Powered Differential Screw
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Solution Overview
Problem
The precise alignment of the grind spindle relative to the wafer surface is critical for achieving a flat and uniform surface profile in semiconductor wafer grinding, but existing methods are time-consuming and require skilled technicians, especially when handling thin wafers or those with varying carrier substrates, leading to inefficiencies and potential damage during processing.
Innovation Solution
A powered alignment adjustment system using a motorized mechanism with a dual-threaded differential screw mechanism and feedback control, enabled by sensors and probes, allows for precise adjustments of the grind spindle alignment, both manually and automatically, to achieve submicron accuracy and reduce the need for trial-and-error procedures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual alignment adjustment methods are used, then alignment precision can be achieved, but the process is time-consuming and requires skilled technicians
Solution Approach 1:
The patent replaces manual mechanical alignment adjustment with an automated motorized system that uses sensors and controllers to precisely position the grind spindle. The motorized adjustment mechanism eliminates the need for skilled technicians to manually manipulate alignment components, thereby reducing both time and dependency on human expertise while maintaining high precision through electronic control and feedback systems.
Solution Approach 2:
The alignment system performs self-adjustment through automated feedback control where sensors detect alignment deviations and the control system automatically actuates the motorized mechanism to correct positioning errors. This self-service capability eliminates the need for continuous human intervention and skilled technical judgment during the alignment process, significantly reducing adjustment time while maintaining precision.
2Reliability
If trial-and-error procedures are used for alignment, then alignment can be achieved, but the process is inefficient and may cause wafer damage
Solution Approach 1:
The patent implements a feedback control system where sensors continuously monitor the alignment status of the grind spindle relative to the wafer. The control system processes this feedback information and automatically adjusts the spindle position to achieve precise alignment. This eliminates trial-and-error procedures by providing real-time guidance, preventing wafer damage through controlled adjustments, and improving productivity by directly achieving correct alignment without repeated attempts.
Solution Approach 2:
The system performs preliminary alignment adjustments using the motorized mechanism before actual grinding begins. The automated system pre-positioning the grind spindle at the correct alignment eliminates the need for subsequent trial-and-error adjustments during wafer processing, thereby protecting wafer integrity and improving overall efficiency by getting the alignment right the first time.
3Productivity
If automated alignment systems are implemented, then productivity and consistency are improved, but device complexity increases
Solution Approach 1:
The motorized alignment adjustment mechanism serves multiple functions: it adjusts grind spindle position, maintains alignment precision, and integrates with the control system for automated operation. By consolidating these functions into a single multi-functional system rather than separate manual components, the patent achieves improved productivity and consistency while limiting the increase in overall device complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the time and expertise required for achieving precise wafer surface profiles, enhances production efficiency, and minimizes wafer damage by enabling precise and automated alignment adjustments, even for wafers with varying carrier substrates, thereby improving the consistency and quality of semiconductor wafer grinding.
Implementation Method 1
a dual-threaded differential screw mechanism
Data Source
AI summary
A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.