Grinding Composite Substrates with High-Pressure Water Jetting
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Solution Overview
Problem
The existing fan out panel level package (FOPLP) technology faces challenges with clogging of grinding wheels during the processing of large-sized composite substrates, leading to increased manufacturing costs and reduced precision, as well as difficulties in managing substrate thickness and electrode formation.
Innovation Solution
A method and apparatus for grinding composite substrates with a resin substrate embedded with semiconductor device chips and electrodes, utilizing a grinding apparatus with a vacuum chuck, fixed abrasive wheel, and high-pressure water supply mechanism to prevent clogging by jetting high-pressure water between the grinding wheel and substrate, allowing for continuous processing with fine grit sizes and achieving surface roughness of 10 nm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a diamond bite fly cutter technique is used for mold resin processing, then processing capability is improved, but manufacturing cost increases and processing time lengthens
Solution Approach 1:
The patent replaces the mechanical diamond bite fly cutter system with a grinding wheel system that uses abrasive grains to grind the mold resin. This substitution allows for more efficient material removal through rotational grinding contact, significantly reducing processing time while maintaining the ability to process mold resin and electrodes effectively
Solution Approach 2:
The patent introduces a water supply mechanism that delivers water to the grinding contact point between the grinding wheel and the composite substrate. This hydraulic element serves multiple functions: cooling the grinding interface, flushing away ground particles to prevent clogging, and enabling continuous high-speed processing without the downtime associated with manual intervention in traditional fly cutter methods
2Manufacturing precision
If fine grit size is used for grinding wheel, then surface roughness is improved to 10 nm or less, but grinding wheel clogging occurs more frequently
Solution Approach 1:
The water supply mechanism continuously flushes the grinding contact area, preventing ground particles from accumulating and clogging the fine grit grains on the grinding wheel surface. This hydraulic flushing system enables the use of fine grit sizes for achieving 10 nm or less surface roughness while maintaining continuous operation without clogging-related interruptions
Solution Approach 2:
Water acts as an intermediary substance between the grinding wheel and the composite substrate. It facilitates the removal of ground particles from the contact interface, allowing fine grit grains to maintain their cutting effectiveness throughout the grinding process without being blocked by accumulated debris
3Device complexity
If conventional grinding method is used without water supply, then device complexity is reduced, but processing precision and continuous operation capability deteriorate
Solution Approach 1:
The water supply mechanism serves multiple functions simultaneously: it cools the grinding interface to prevent thermal damage and maintain precision, flushes away ground particles to prevent clogging and maintain surface quality, and enables continuous high-speed operation. This multi-functional addition justifies the increased device complexity by delivering comprehensive benefits that conventional single-function grinding systems cannot achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables continuous grinding of large-sized FOPLP substrates with high precision, reducing manufacturing costs and extending the life of the grinding wheel, thereby improving productivity and achieving the goal of cost reduction in semiconductor device packaging.
Implementation Method 1
supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member
Implementation Method 2
jetting high-pressure water between the grinding wheel and substrate
Implementation Method 3
grinding apparatus with a vacuum chuck
Implementation Method 4
bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface
Data Source
AI summary
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.