Grinding Wheel Truing Tool for Wafer Edge Groove Compensation
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Solution Overview
Problem
Conventional wafer edge grinding technologies face issues with wear unbalance and life reduction of grinding wheels due to uneven wear patterns and over-grinding, leading to quality defects and increased downtime.
Innovation Solution
A truing tool system with custom-designed truers for notch and round fine-grinding wheels, featuring trapezoidal and semicircular cross-sectional shapes respectively, to compensate and maintain the original shape of grooves, preventing over-grinding and extending the life of grinding wheels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal bond groove is used in the grinding wheel, then wear resistance is improved, but grinding quality deteriorates due to damaged layers and fine scratches
Solution Approach 1:
The grinding wheel is divided into multiple grooves with different bond materials along the circumferential direction. Specifically, the groove includes a resin bond groove portion for fine grinding and a metal bond groove portion for rough grinding, allowing each segment to perform its specialized function without compromising the other
Solution Approach 2:
Different portions of the groove are assigned different bond materials with different properties. The resin bond portion provides good grinding quality with minimal damaged layers, while the metal bond portion provides high wear resistance. This local differentiation allows the single groove to simultaneously achieve both high grinding quality and high wear resistance
2Manufacturing precision
If a resin bond groove is used in the grinding wheel, then grinding quality is improved, but wear resistance deteriorates leading to shape changes
Solution Approach 1:
The groove is segmented into resin bond and metal bond portions along the circumferential direction. The resin bond segment handles fine grinding operations where quality is paramount, while the metal bond segment handles rough grinding where wear resistance is more critical
Solution Approach 2:
The resin bond material is locally applied in the groove portion that contacts the wafer edge during fine grinding, providing excellent grinding quality. The metal bond material is applied in portions that experience higher wear, providing structural stability and wear resistance
3Manufacturing precision
If double grinding is performed to compensate for quality reduction and life reduction, then grinding quality is improved, but process complexity and time increase
Solution Approach 1:
The invention merges the functions of rough grinding and fine grinding into a single groove structure. The groove contains both metal bond portions (for rough grinding) and resin bond portions (for fine grinding), allowing both operations to be performed in one grinding pass rather than requiring separate double grinding processes
Solution Approach 2:
The single groove is designed to perform multiple functions simultaneously - it can rough grind using metal bond portions and fine grind using resin bond portions. This multi-functionality eliminates the need for separate rough grinding and fine grinding wheels or processes, reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses wear unbalance and over-grinding issues, maintaining groove shape and quality, reducing equipment downtime, and enabling automatic compensation processes.
Implementation Method 1
A grinding wheel has a groove, of which shape corresponds to that of the edge of the semiconductor wafer, in conformity with the predetermined quality specifications
Data Source
AI summary
The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.