Grip Sensing Chip Temperature Compensation for Accurate Touch Detection
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Solution Overview
Problem
Conventional grip sensing apparatuses face inaccuracies in grip sensing due to temperature variations, leading to potential malfunctions and unnecessary power consumption, as they rely on external reference sensing elements for temperature compensation, which is inefficient and prone to errors.
Innovation Solution
A grip sensing method and apparatus that incorporates a temperature sensor within the grip sensing chip to perform differential amplification, digital conversion, and nonlinear temperature compensation, allowing for accurate grip event detection without external reference elements, using a prestored look-up table to update baseline counts based on temperature changes and slopes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external reference sensing elements are used for temperature compensation, then temperature compensation can be performed, but the device complexity increases and manufacturing cost increases
Solution Approach 1:
The temperature sensor is integrated directly into the grip sensing chip, merging the temperature sensing function with the grip sensing function. This eliminates the need for separate external reference sensing elements, thereby reducing device complexity while maintaining temperature compensation capability and grip sensing accuracy
Solution Approach 2:
The grip sensing chip is designed to perform multiple functions: both grip sensing and temperature sensing. By making the chip universal, it can compensate for temperature effects internally without requiring additional external components, thus reducing overall device complexity
2Reliability
If external reference sensing elements are used for temperature compensation, then temperature compensation can be performed, but manufacturing cost increases
Solution Approach 1:
By integrating the temperature sensor into the grip sensing chip, the patent reduces the total component count and assembly steps. This merging of functions lowers manufacturing costs by eliminating the need for separate external reference sensing elements and their associated mounting and wiring requirements
Solution Approach 2:
The multi-functional grip sensing chip that performs both grip sensing and temperature sensing reduces bill of materials costs and simplifies the supply chain. This universal design approach lowers manufacturing costs while maintaining the ability to perform temperature compensation for accurate grip sensing
3Measurement precision
If baseline tracking is performed continuously, then baseline count can be updated, but power consumption increases
Solution Approach 1:
The patent implements periodic baseline tracking that is activated only when temperature changes are detected or at scheduled intervals, rather than continuous tracking. This periodic approach maintains baseline accuracy when needed while significantly reducing power consumption during stable temperature conditions
Solution Approach 2:
The system uses temperature sensor feedback to trigger baseline tracking only when temperature changes exceed a certain threshold. This feedback-based triggering ensures baseline accuracy is maintained when temperature affects sensing while avoiding unnecessary power consumption during stable temperature periods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise temperature compensation, reducing the likelihood of grip sensing errors and malfunctions, while maintaining a simple internal circuit structure and low costs, ensuring accurate detection of grip events and preventing grip lock phenomena.
Implementation Method 1
a temperature sensor mounted therein
Implementation Method 2
generating a sensing count by differentially amplifying a voltage potential of a grip channel based on a predetermined correction offset
Data Source
AI summary
Disclosed herein are grip sensing method and apparatus. The grip sensing method includes generating a sensing count by differentially amplifying a voltage potential of a grip channel based on a predetermined correction offset and performing digital conversion, comparing the sensing count with a predetermined base value to determine whether a touch condition is satisfied, performing baseline tracking for determining a baseline count based on the sensing count when the sensing count is less than the base value and the touch condition is not satisfied, stopping the baseline tracking and performing temperature compensation with respect to the baseline count using a temperature sensor mounted therein when the sensing count is equal to or greater than the base value and the touch condition is satisfied, and sensing an event based on the sensing count and the temperature-compensated baseline count.