Robotic Gripper Sensor for Fine Wire Alignment
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Solution Overview
Problem
The complex process of soldering fine wires onto circuit boards requires high precision and delicate force manipulation, which is challenging for robotic systems due to the fragility of existing feedback-enabled robotic systems and the thermal shock encountered in laser soldering processes, leading to inconsistent quality and high operational costs.
Innovation Solution
A fine wire robotic gripper sensor device with a built-in force sensor and a housing for a sensor probe, featuring a positioning arm with a weakened pivot point, allowing for precise alignment and force measurement while protecting the sensor from thermal shock, enabling accurate and robust robotic wire manipulation in laser soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional hot iron tip soldering by human operator is used, then high quality solder joints can be achieved, but the process is extremely time-consuming and costly
Solution Approach 1:
The patent replaces the traditional mechanical hot iron tip soldering system with a laser-based soldering system. The laser beam delivers thermal energy precisely to the solder joint without physical contact, eliminating the need for manual manipulation of hot irons and enabling automated, high-speed soldering while maintaining joint quality.
Solution Approach 2:
The patent introduces a force sensing robotic gripper as an intermediary between the laser soldering system and the wire. The gripper applies controlled force to hold and position the wire during laser soldering, enabling precise wire control and positioning without direct human manipulation, thus achieving both high quality and efficiency.
2Productivity
If robotic manipulation device is used for wire soldering, then productivity increases, but the device encounters thermal shock and cannot withstand the laser soldering process
Solution Approach 1:
The patent extracts the force sensing capability from the robotic manipulation device itself and integrates it into a separate gripper system. This allows the robotic arm to provide positioning and control while the dedicated gripper with force sensor handles the wire manipulation and force application, separating the functions to improve both productivity and thermal shock resistance.
Solution Approach 2:
The patent employs a force sensing gripper that can be replaced or reset after exposure to thermal conditions. The gripper serves as a sacrificial component that protects the main robotic system from thermal damage, allowing continuous operation through replacement rather than repair of the entire system.
3Manufacturing precision
If high-accuracy feedback enabled robotic system is used, then wire alignment precision improves, but the system becomes too fragile for wire soldering automation
Solution Approach 1:
The patent segments the robotic wire soldering system into distinct functional modules: a robotic arm for positioning, a force sensing gripper for wire manipulation, and a laser source for soldering. Each module is optimized independently, with the gripper containing the fragile force sensing components while the robotic arm provides robust positioning, reducing overall system fragility while maintaining alignment precision.
Solution Approach 2:
The force sensing gripper acts as an intermediary between the robust robotic positioning system and the delicate wire. It provides the necessary force feedback and delicate manipulation capabilities that protect the main robotic system from direct exposure to thermal and mechanical stresses, reducing system fragility while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The robotic gripper sensor device achieves high-accuracy, high-reliability wire alignment and soldering with delicate force-sensing capabilities, reducing operational time and costs, and ensuring consistent quality in large batch production by withstanding thermal shock and maintaining precise control during the laser soldering process.
Implementation Method 1
the probe to convert a stress change of the portion of the probe into a force reading
Data Source
AI summary
A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.