Gripping Frame Bending for Uniform Resin Sheet Thickness
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Solution Overview
Problem
The existing resin forming method results in non-uniform thickness of the resin sheet material due to uneven contact with the lower die, leading to reduced product quality.
Innovation Solution
A resin forming system with a gripping device that grips the resin sheet material at its side end portions and includes a lowering device to bend the gripping frame, allowing it to protrude upward and come into contact with the lower die's protrusion shape, ensuring uniform contact and stretching of the resin sheet material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lower die is brought toward the resin sheet material without gripping frame bending, then the forming process is simpler, but the resin sheet material thickness becomes non-uniform
Solution Approach 1:
The gripping frame is designed with bending portions that allow it to dynamically change its shape during the forming process. The frame bends to match the protrusion shape of the lower die, enabling the resin sheet material to be stretched uniformly across the entire surface including edge portions, thereby achieving uniform thickness without requiring complex additional actuators.
Solution Approach 2:
The gripping frame incorporates curved bending portions that correspond to the protrusion shape of the lower die. This curvature allows the frame to conform to the die geometry, ensuring that the resin sheet material is stretched evenly across the forming surface and preventing non-uniform thickness in the final product.
2Manufacturing precision
If additional actuators are added to bend the gripping frame, then the resin sheet material thickness uniformity is improved, but the device complexity increases
Solution Approach 1:
The gripping frame is designed to bend automatically through its own structural flexibility when brought into contact with the lower die. The bending portions of the frame naturally conform to the die's protrusion shape without requiring external actuators, thereby achieving uniform resin sheet material stretching while keeping the device structure simple and compact.
Solution Approach 2:
The gripping frame's physical state is changed from rigid to flexible during the forming process. By allowing the frame to bend and change its geometric parameters to match the lower die's protrusion shape, the system achieves uniform resin sheet material thickness without the need for complex actuation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform thickness of the resin sheet material, improving product quality by allowing the resin sheet material to be stretched uniformly and eliminating the need for additional actuators to bend the gripping frame, resulting in a more compact forming device.
Implementation Method 1
a heating device for heating a resin sheet material gripped by the gripping frame
Implementation Method 2
a stretching device for stretching, in the X-direction and the Y-direction, a resin sheet material heated by the heating device and gripped by the gripping frame
Implementation Method 3
a pair of bending support portions provided on both sides in the Y-direction of the lower die, each one of the pair of bending support portions coming into contact with a portion of the gripping frame when the gripping device is lowered by the lowering device and bending the gripping frame to protrude upward in a side view along the Y-direction
Implementation Method 4
a lowering device for lowering the gripping device and bringing a resin sheet material gripped by the gripping frame toward the lower die
Data Source
AI summary
A resin molding system 1 comprises a gripping device 3 provided with a gripping frame 30 for gripping a resin sheet material 2, a heating device for heating the resin sheet material 2 and a molding device for clamping a lower die 61 and an upper die, and affixing the resin sheet material 2 to a substrate 63. The molding device is provided with: a lowering device for lowering the gripping device 3 and causing the resin sheet material 2 gripped by the gripping frame 30 to approach the lower die 61; and a pair of bent posts 67, 68 which are provided on both Y-direction sides of the lower die 61, and which come in contact with portions of the gripping frame 30 when the gripping device 3 is lowered, and which convexly bend the gripping frame 30 upward as viewed from the side along the Y-direction.