Groove Cross-Section Measurement Using 2D Projection Data

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Solution Overview

Problem

Existing dicing devices require significant processing load on control devices to configure three-dimensional data of machined grooves, leading to inefficiencies and potential inaccuracies in cross-sectional profile calculations.

Innovation Solution

A method and device that acquire three-dimensional coordinate data, generate two-dimensional projection data, and calculate cross-sectional profiles without constructing three-dimensional models, utilizing distributed processing across multiple calculation devices to reduce load on control devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If three-dimensional data is configured to calculate cross-sectional profile, then measurement completeness is improved, but processing load on control device increases

Engineering Contradiction:
Improvecross-sectional profile measurement accuracyVSAvoidprocessing load on control device
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts only the necessary two-dimensional projection data from the three-dimensional coordinate data, rather than processing the complete three-dimensional model. This extraction approach obtains sufficient information for cross-sectional profile calculation while significantly reducing the processing load on the control device.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent creates a two-dimensional projection copy of the three-dimensional coordinate data instead of processing the original three-dimensional data structure. This copied two-dimensional representation contains all necessary information for cross-sectional profile measurement but requires minimal processing resources.

Inventive Principle:
Principle #26Copying

2Measurement precision

If three-dimensional data is configured for groove shape analysis, then comprehensive shape information is obtained, but measurement time increases

Engineering Contradiction:
Improvegroove shape information completenessVSAvoidprocessing time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent extracts only the essential two-dimensional projection information needed for groove shape analysis from the three-dimensional coordinate data. This selective extraction obtains all necessary shape information while avoiding the time-consuming process of configuring and processing complete three-dimensional models.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentEP4635678A1Groove shape measurement method, groove shape measurement device, processing device control method, and processing device
Publication Date: 2025.10.22 TOKYO SEIMITSU CO LTD
  • EP4635678A1 patent drawingFigure 1
  • EP4635678A1 patent drawingFigure 2
  • EP4635678A1 patent drawingFigure 3

AI summary

This groove shape measurement method has a coordinate data acquisition step of acquiring a plurality of pieces of three-dimensional coordinate data (three-dimensional coordinate data set (60)) indicating a shape of a machined groove (9) formed in a machining target object (workpiece (W)) in a machining feed direction (X direction) by a machining device (dicing device (10)) (Step S1), a projection data generation step of generating two-dimensional projection data (62) of the machined groove (9) by projecting the three-dimensional coordinate data onto a two-dimensional plane (two-dimensional plane (61)) perpendicular to the machining feed direction (Step S2), and a cross-sectional profile calculation step of calculating a cross-sectional profile (64) of the machined groove (9) on the basis of the two-dimensional projection data (62) (Step S3).