Groove-Type Drying Structure for Silicon Wafers
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Solution Overview
Problem
Current groove-type drying methods for solar silicon wafers and load-bearing parts are characterized by large volume, high energy consumption, low drying efficiency, and complex installation processes.
Innovation Solution
A groove-type drying structure featuring a drying groove with air current channels, a heating device, temperature detector, and an air wheel driven by a motor, which circulates heated air to efficiently dry the wafers and load-bearing parts while maintaining a small volume and simple installation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a tunnel-type drying method is used, then the drying process can be continuous, but it occupies a large area and has low drying efficiency
Solution Approach 1:
The patent transitions from a horizontal tunnel-type drying structure to a vertical groove-type drying structure. The drying groove extends in the vertical direction with the silicon wafer placed horizontally within it, allowing heated air to flow upward through the wafer. This dimensional change enables compact footprint while maintaining effective drying path length, resolving the contradiction between large area occupation and drying efficiency.
2Productivity
If a conventional groove-type drying method is used, then the structure is simple, but it has large volume, high energy consumption and low drying efficiency
Solution Approach 1:
The patent implements continuous air circulation through the heating device and air wheel system. Heated air continuously flows through the silicon wafer via the air current channels, ensuring uninterrupted drying action. This continuous useful action improves drying efficiency while the recirculating nature of the system reduces overall energy consumption compared to conventional methods that require larger volumes and longer drying times.
3Ease of manufacture
If the air wheel is positioned at the bottom of the drying groove, then the structure is simplified and installation is convenient, but air circulation effectiveness must be maintained
Solution Approach 1:
The air wheel serves as an intermediary component positioned at the bottom of the drying groove. It draws air from the environment through the air inlet, passes it through the heating device, and directs the heated air upward through the air current channels into the silicon wafer. This bottom-positioned air wheel simplifies the overall structure and installation while maintaining effective air circulation through its strategic placement and connection to the heating and channel systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high drying efficiency with a compact design and easy setup, reducing energy consumption and installation complexity.
Implementation Method 1
A heating device and a temperature detector are installed in the air current channels at the two sides
Implementation Method 2
the heated air is pumped by the air wheel, so that air circulation is formed inside the drying groove to dry the load bearing part and the silicon wafer
Data Source
AI summary
A groove-type drying structure includes a drying groove having a cover. The drying groove is internally provided with an inner groove body. The inner groove body forms air current channels with the two sides and the bottom part of the drying groove. The upper part of the drying groove is provided with an air outlet, and the inner groove body is provided with an air compensation port. A heating device and a temperature detector are installed on the air current channels at the two sides. An air wheel is arranged in the air current channel at the bottom part, an air inlet of the air wheel is communicated with an inner chamber of the inner groove body, and a rotating shaft of the air wheel is connected with a motor installed in the bottom part of the drying groove.