Groove-Embedded Chip Shielding in Compact Semiconductor Packages
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Solution Overview
Problem
Conventional semiconductor packages face challenges in providing effective electromagnetic shielding without increasing volume and cost, which is contrary to the trend of miniaturization.
Innovation Solution
The semiconductor package incorporates a substrate with a groove containing a chip, and a shielding layer composed of multiple sub-shielding layers that provide electromagnetic shielding without increasing the package volume. The shielding layer is connected integrally to enhance its strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding cases (or covers) are provided outside the devices, then electromagnetic shielding effect is improved, but volume and cost of the semiconductor packages increase
Solution Approach 1:
The shielding layer is nested within the groove structure of the substrate, integrating the shielding function into the existing package architecture rather than adding external shielding cases. This nested configuration provides electromagnetic shielding while maintaining compact package volume.
Solution Approach 2:
The shielding function is transitioned from a three-dimensional external shielding case to a two-dimensional layered structure within the substrate plane. The shielding layer is disposed between the active surface and the bottom surface of the groove, utilizing the vertical dimension within the existing package footprint to achieve shielding without increasing overall volume.
2Object-affected harmful factors
If shielding cases (or covers) are provided outside the devices, then electromagnetic shielding effect is improved, but cost of the semiconductor packages increases
Solution Approach 1:
The shielding layer is merged with the substrate structure and formed as an integrated component during the manufacturing process. The shielding layer is disposed between the active surface and the bottom surface of the groove, combining the substrate and shielding functions into a single manufacturing process, thereby reducing cost compared to separate shielding cases.
Solution Approach 2:
The substrate structure serves multiple functions: it provides mechanical support, defines the groove for chip mounting, and incorporates the shielding layer for electromagnetic interference protection. This multi-functional design eliminates the need for separate shielding components, reducing overall manufacturing cost.
3Object-affected harmful factors
If multiple sub-shielding layers are used, then electromagnetic shielding effect and reliability are improved, but device complexity increases
Solution Approach 1:
The shielding layer is segmented into multiple sub-shielding layers disposed at different positions within the groove: between the active surface and the bottom surface of the groove, and between the inactive surface and the top surface of the substrate. This segmentation enhances shielding effectiveness by creating multiple barriers to electromagnetic interference while maintaining a relatively simple overall structure.
Data Source
AI summary
A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a substrate including first and second surfaces opposite to each other and a groove recessed from the first surface, a chip within the groove and including an active surface facing a bottom surface of the groove, an inactive surface opposite to the active surface, and a side surface connecting the active surface with the inactive surface, chip pads on the active surface of the chip, a shielding layer including a first sub-shielding layer between the bottom surface of the groove and the active surface of the chip and including openings corresponding to the chip pads, respectively, a third sub-shielding layer on the inactive surface of the chip, and a second sub-shielding layer between the side surface of the chip and a side surface of the groove and connecting the first and third sub-shielding layers.