Groove-Filled Substrate Coating for Flat, Crack-Resistant Films
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Solution Overview
Problem
The existing methods for manufacturing substrates with grooves, such as those used in electronic devices, face challenges with low planarity, high likelihood of cracks, and inefficient planarization of cured films, especially when dealing with complex or deep groove structures.
Innovation Solution
A method involving applying a cured film forming composition to fill grooves, removing surplus material using a separation member to enhance flatness, and subsequent curing at elevated temperatures to achieve a high-density, crack-resistant film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a liquid composition is applied to fill grooves with complicated structure or deep grooves, then the grooves are filled, but the planarization of the formed coating film becomes low and the film thickness becomes uneven
Solution Approach 1:
The patent applies a liquid composition to fill grooves before curing, performing the filling action in advance. The composition is applied in an amount that fills the grooves completely, ensuring that even deep or complicated grooves are properly filled before the curing process begins, which prevents subsequent planarization issues
Solution Approach 2:
The patent changes the physical state of the composition from liquid to cured film through curing. By controlling the curing process parameters (temperature, time), the composition transforms into a solid film that maintains the filled groove structure while achieving the desired mechanical properties and planarization
2Quantity of substance
If the film thickness is uneven, then the coating can be applied, but film stress becomes uneven during heating for curing, cracks are likely to occur, and it becomes difficult to form a dense cured film
Solution Approach 1:
The liquid composition is applied in advance to ensure uniform distribution and complete filling of grooves before curing. This preliminary filling action ensures that the composition reaches all areas uniformly, preventing thickness variations that would lead to stress concentration and cracking during subsequent heating
Solution Approach 2:
The curing process transforms the liquid composition into a solid cured film through controlled parameter changes (temperature, time). This transformation ensures uniform densification throughout the film, preventing crack formation while maintaining the filled groove structure
3Manufacturing precision
If CMP is used for planarization, then planarization can be performed, but differences in planarization characteristics occur due to hardness and chemical properties, and it is inefficient for planarizing thick films
Solution Approach 1:
The patent replaces the mechanical CMP process with a chemical filling approach. Instead of mechanically removing material to achieve planarization, the liquid composition chemically fills the grooves and is then cured to form a planar surface, eliminating the inefficiencies of CMP for thick films while achieving superior planarity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved planarity, reduced crack occurrence, and an efficient manufacturing process for substrates with high-density cured films, suitable for electronic devices.
Implementation Method 1
heating the substrate to cure the composition layer in which the surplus part is removed
Data Source
AI summary
A method for manufacturing a processed substrate includes the following steps:(a) applying a cured film forming composition on a substrate having grooves in an amount sufficient to fill grooves to form a composition layer; (b) removing the surplus part from the composition layer by scraping off using a separation member to form a substrate surface with improved flatness; and (c) heating the substrate to cure the composition layer in which the surplus part is removed.