Groove-Isolated Wires for OLED Encapsulation
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Solution Overview
Problem
High-temperature laser sintering during OLED display encapsulation can cause metal wires to melt, leading to short circuits and display defects due to the high melting points of materials like aluminum.
Innovation Solution
A display substrate design featuring an insulating layer with grooves in the encapsulation area, where wires have a second portion located within these grooves, isolating adjacent wires and preventing melting-induced short circuits by ensuring the melted wire does not contact adjacent wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature laser sintering is used for encapsulation, then sealing quality is improved, but metal wires may melt causing short circuits
Solution Approach 1:
The patent divides the encapsulation area into multiple isolated regions by forming grooves in the encapsulation layer. These grooves segment the space around metal wires, creating independent compartments that prevent melted wire material from spreading to adjacent wires during high-temperature laser sintering, thus resolving the contradiction between achieving good sealing and preventing wire melting damage
Solution Approach 2:
The patent introduces the encapsulation layer with grooves as an intermediary protective structure between the metal wires and the harmful high-temperature laser energy. This intermediary layer absorbs and dissipates the thermal energy, preventing direct thermal damage to the wires while still allowing effective encapsulation sealing to be formed
2Reliability
If high-temperature sintering is applied to achieve sealing, then encapsulation effectiveness is improved, but display defects occur due to wire short circuits
Solution Approach 1:
By segmenting the encapsulation area into isolated regions through grooves, the patent enables effective encapsulation sealing while preventing the propagation of melted wire material that would cause short circuits and display defects, thus maintaining both encapsulation effectiveness and display quality
Solution Approach 2:
The patent applies beforehand cushioning by pre-forming grooves in the encapsulation layer before the laser sintering process. These grooves act as preventive measures that cushion and contain any potential wire melting, preventing it from causing short circuits and display defects before they can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the probability of display defects by isolating wires within the grooves, preventing short circuits during high-temperature encapsulation, thus ensuring the integrity of the OLED display.
Implementation Method 1
the encapsulation sealant between a display substrate and a display cover plate needs to be sintered at a high temperature by using laser
Implementation Method 2
the encapsulation sealant between a display substrate and a display cover plate needs to be sintered at a high temperature
Implementation Method 3
metal wires on the display substrate may be melted as a result of the high sintering temperature
Data Source
AI summary
The present disclosure relates to the field of display technologies, and provides a display substrate, a manufacturing method thereof, a corresponding display panel and an encapsulation method for the same. The display substrate includes a base plate comprising a display area and an encapsulation area surrounding the display area, and an insulating layer and a plurality of wires located on the base plate. The insulating layer comprises at least one groove in the encapsulation area. At least one of the plurality of wires comprises a first portion in the display area and a second portion within a corresponding groove of the encapsulation area. There is only one said second portion present in each groove.