Groove-Structured Sensor Holding Member for Thermal Stress Reduction
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Solution Overview
Problem
Existing physical quantity measurement devices face issues with thermal stress and airtightness due to the difference in thermal expansion coefficients between sensor chips and bonding members, leading to potential deterioration in measurement accuracy.
Innovation Solution
The implementation of a physical quantity measurement device with a holding member featuring grooves that contain excess bonding material, preventing it from spreading to the corners of the sensor chip and reducing thermal stress, while ensuring stable bonding and high accuracy through strategically placed grooves and protrusions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sensor chip is attached to a mounting member using a bonding member, then the sensor chip can be securely fixed, but thermal stress concentrates on the corner portion of the sensor chip due to the difference in thermal expansion coefficient between the bonding member and the sensor chip, which may destroy airtightness
Solution Approach 1:
The groove structure creates a localized region where excess bonding member can be contained, allowing the bonding member to have different properties in different regions: sufficient bonding strength in the attachment area while preventing stress concentration at corners through the groove boundaries
Solution Approach 2:
The groove acts as an intermediary structure between the mounting member and the sensor chip, providing a controlled environment for the bonding member that mediates between the need for strong bonding and the need to prevent thermal stress concentration
2Strength
If a large area sensor chip is used to ensure stable attachment, then bonding strength is improved, but thermal stress concentration at corner portions increases, leading to potential airtightness failure
Solution Approach 1:
The groove structure creates localized regions that control the distribution and behavior of the bonding member, allowing large-area attachment for strength while preventing harmful stress concentration at specific corner locations through the groove boundaries
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains high measurement accuracy by preventing thermal stress concentration and airtightness loss, enhancing the device's reliability and precision in multi-axis measurements.
Implementation Method 1
the holding portion has a groove formed in a region facing the physical quantity measurement sensor... an extra amount of a bonding member flows into the groove
Implementation Method 2
a sensor element that detects a physical quantity to be measured... a physical quantity measurement sensor including a sensor element and a package
Data Source
AI summary
A physical quantity measurement device includes a physical quantity measurement sensor and a metal block that is a holding member that includes block surfaces that serve as a plurality of holding portions for holding the physical quantity measurement sensor, and the block surface has a groove formed in a region facing the physical quantity measurement sensor.