Light-emitting Device Groove Wiring for Substrate Complexity
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Solution Overview
Problem
In densely mounted light source configurations, the complexity of wiring on the substrate side increases, making it challenging to efficiently connect and manage the electrical connections of multiple light-emitting elements.
Innovation Solution
A light-emitting device manufacturing method involving the formation of a groove structure on the lower surface of the light-emitting module using laser light to expose electrodes, which are then filled with electrically conductive material to form wirings, thereby simplifying the electrical connections and reducing substrate complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If light sources are densely mounted on the substrate, then the light source density is improved, but the wiring complexity on the substrate increases
Solution Approach 1:
The patent moves the wiring structure from the substrate plane to the vertical dimension by forming grooves in the encapsulant above the light-emitting elements. This dimensional transition allows wirings to be positioned in three-dimensional space rather than constrained to the two-dimensional substrate plane, thereby reducing wiring complexity while maintaining high light source density.
Solution Approach 2:
The wirings are nested within grooves formed in the encapsulant material, creating a hierarchical structure where conductive elements are embedded within the encapsulant matrix. This nesting approach organizes the wiring structure efficiently and reduces the overall device footprint without increasing substrate complexity.
2Adaptability or versatility
If finer and more complicated wiring is formed in the substrate, then the electrical connection capability is improved, but the manufacturing difficulty increases
Solution Approach 1:
The patent extracts the wiring function from the substrate and relocates it to the encapsulant structure. By removing the requirement for complex substrate wiring, the manufacturing process is simplified while the electrical connection capability is maintained through the groove-based wiring structure that directly connects to light-emitting element electrodes.
Solution Approach 2:
The grooves for accommodating wirings are formed in the encapsulant before the final assembly and wiring insertion steps. This preliminary formation of the wiring pathway simplifies subsequent manufacturing steps, as the structural framework for electrical connections is already in place, reducing overall manufacturing difficulty.
3Ease of manufacture
If the substrate wiring is simplified, then the manufacturing ease is improved, but the electrical connection flexibility may be reduced
Solution Approach 1:
The wiring structure is designed with flexible grooves in the encapsulant that can accommodate different wiring configurations. The groove-based structure allows for dynamic adaptation to different electrical connection requirements while maintaining a simple overall manufacturing process, as the same encapsulant structure can be used with varying wiring patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the avoidance of complex wiring on the substrate, facilitating easier electrical connections between light-emitting elements and enabling the production of thinner, more reliable light-emitting devices with improved anchoring effects.
Implementation Method 1
removing part of the covering member, part of the first electrode and part of the second electrode by irradiation with laser light from a first surface side to form a groove structure
Data Source
AI summary
A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.