Groove-Defined Wiring Substrate for Burr-Free Electrode Cutting
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Solution Overview
Problem
The existing method of manufacturing electronic components can result in burrs on electrodes during cutting, leading to positional deviations and unstable mounting, which may cause short circuits or prevent accurate mounting on a substrate.
Innovation Solution
The electronic component design features a wiring substrate with a groove portion and electrodes spaced apart from the side surface, allowing for burr-free cutting and reliable electrical connections through a connection conductor that creeps into the groove, enhancing mounting accuracy and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the wiring substrate is cut from the one surface side to accommodate the resin portion, then the cutting process can be completed, but burrs protruding toward the opposite side are formed on the cut surface of the electrode on the other surface
Solution Approach 1:
The patent applies preliminary action by forming the groove portion in the side surface of the wiring substrate before the cutting process. This groove structure is prepared in advance to guide and contain any burrs that may form during cutting, preventing them from protruding onto the electrode surface. The groove acts as a pre-prepared receptacle that captures manufacturing imperfections before they can affect the final product quality.
2Productivity
If burrs are formed on the electrode, then the cutting process is completed, but positional deviation occurs when the electronic component is mounted or the component cannot be stably mounted
Solution Approach 1:
The patent converts the harmful effect of burr formation into a beneficial outcome by designing the groove portion to specifically capture and contain these burrs. Instead of viewing burrs as purely detrimental, the invention utilizes them being directed into the groove as a means to protect the electrode surface. The groove transforms the potential harm of burrs into a controlled situation where they are isolated and cannot interfere with mounting operations.
3Manufacturing precision
If the second electrode is spaced apart from the side surface, then no burr is formed on the second electrode, but the formation region of the second electrode and mounting electrode must be increased
Solution Approach 1:
The patent applies segmentation by dividing the wiring substrate structure into distinct functional zones: the electrode formation area, the groove portion, and the side surface region. This spatial segmentation allows the electrode to be positioned away from the cutting edge while the groove captures any burrs, effectively separating the functions of electrode formation and burr management into different spatial zones.
Data Source
AI summary
An electronic component includes a wiring substrate having a first surface, a second surface opposite to the first surface, a side surface connected to the first surface and the second surface, and a groove portion formed in the side surface and extending from the first surface to the second surface. The electronic component further includes a first electrode disposed on the first surface along the first surface, a second electrode disposed on the second surface along the second surface, a connection conductor disposed over an entire inner surface of the groove portion and electrically connected to the first electrode and the second electrode, an electronic element disposed on the first surface and electrically connected to the first electrode, and a resin portion disposed on the first surface. All edges of the second electrode are spaced apart from the side surface.