Grooved Adhesive Layer for Bubble-Free Stacked Electronics

Solution Overview

Problem

Air bubbles between adhesive layers and other stacked layers in electronic devices cause poor appearance flatness, leading to issues with electrical connectivity and overall device reliability.

Innovation Solution

Incorporating grooves in the adhesive layer as exhaust channels to discharge air bubbles towards the edges, ensuring the adhesive layer remains structurally intact and maintains electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If air bubbles are trapped between adhesive layer and stacked layers, then adhesive bonding is achieved, but appearance flatness deteriorates and electrical connectivity is compromised

Engineering Contradiction:

Improveelectrical connectivityVSAvoidappearance flatness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The adhesive layer is segmented by forming multiple grooves that divide it into distinct regions. These grooves create channels that allow air bubbles to be directed toward edges while maintaining adhesive bonding in the remaining areas, thus resolving the contradiction between maintaining bonding and eliminating air bubbles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The grooves act as intermediary channels between the adhesive layer and the edges. They provide a designated pathway for air bubbles to escape without compromising the adhesive bonding between layers, thereby improving appearance flatness while maintaining electrical connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If adhesive layer is made continuous for structural integrity, then strength is improved, but air bubble entrapment increases

Engineering Contradiction:

Improveadhesive layer integrityVSAvoidair bubble entrapment

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The adhesive layer is segmented by forming multiple grooves that divide it into distinct regions. These grooves create channels that allow air bubbles to be directed toward edges while maintaining adhesive bonding in the remaining areas, thus resolving the contradiction between maintaining bonding and eliminating air bubbles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive layer are given different functions: areas with grooves serve as air escape channels, while areas between grooves maintain adhesive bonding functionality. This local differentiation allows the adhesive layer to simultaneously achieve structural integrity and air bubble elimination.

Inventive Principle:

Principle #3Local quality

3Shape

If grooves are added to adhesive layer to remove air bubbles, then appearance flatness is improved, but device complexity increases

Engineering Contradiction:

Improveappearance flatnessVSAvoidadhesive layer structure

Core Design Contradiction:

ShapeVSDevice complexity

Solution Approach 1:

The adhesive layer is segmented by forming multiple grooves that divide it into distinct regions. These grooves create channels that allow air bubbles to be directed toward edges while maintaining adhesive bonding in the remaining areas, thus resolving the contradiction between maintaining bonding and eliminating air bubbles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive layer is designed with a porous-like structure containing multiple grooves. This groove structure provides air escape pathways while maintaining the overall integrity and bonding function of the adhesive layer, improving appearance without excessive complexity.

Inventive Principle:

Principle #31Porous materials

Data Source

PatentUS12495643B2Electronic device comprising stacked layers and grooves

Publication Date: 2025.12.09 INNOLUX CORP

AI summary

An electronic device is provided. The electronic device includes a support substrate, a first substrate, a semiconductor element, and an adhesive layer. The first substrate is disposed on the support substrate. The semiconductor element is disposed on the first substrate. The adhesive layer is disposed between the support substrate and the first substrate. The adhesive layer includes a plurality of grooves. The electronic device provided by the disclosure is capable of improving the appearance flatness problem caused by air bubbles between the adhesive layer and other stacked layers through the grooves of the adhesive layer.