Grooved Buffer Layer for Display Panel Stress Management
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Solution Overview
Problem
The high-temperature manufacturing process of display panels results in heterogeneous interfacial stress between different layers, leading to glass substrate deformation and chipping, which reduces process reliability and yield.
Innovation Solution
A method involving a glass substrate with multiple display areas and a connection area, where a buffer layer with grooves is formed, and additional layers such as a gate insulating layer, dielectric layer, and passivation layer are created, extending into these grooves to reduce stress and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple display panels are mixed and arranged on the same glass substrate using a common photomask, then development costs are reduced and glass substrate utilization is increased, but heterogeneous interfacial stress between different layers causes deformation or chipping of the glass substrate
Solution Approach 1:
The buffer layer is divided into multiple independent buffer regions through grooves, which segment the continuous layer into discrete units. This segmentation isolates the stress in the connection area from the display areas, preventing stress propagation that would cause glass substrate deformation or chipping while maintaining high substrate utilization.
Solution Approach 2:
The buffer layer is designed with different structures in different regions: the connection area has a segmented buffer layer with grooves to handle stress, while the display areas maintain continuous buffer layers for normal function. This local differentiation allows the structure to optimize for both stress management and functional performance in specific zones.
2Ease of manufacture
If continuous layers are formed on the glass substrate in the connection area, then manufacturing is simplified, but heterogeneous interfacial stress causes deformation or chipping of the glass substrate
Solution Approach 1:
The buffer layer is divided into multiple independent buffer regions through grooves, which segment the continuous layer into discrete units. This segmentation isolates the stress in the connection area from the display areas, preventing stress propagation that would cause glass substrate deformation or chipping while maintaining high substrate utilization.
3Strength
If the film thickness and film area in the connection area are increased, then the connection structure is strengthened, but heterogeneous interface stress increases causing greater warpage and deformation
Solution Approach 1:
The buffer layer is divided into multiple independent buffer regions through grooves, which segment the continuous layer into discrete units. This segmentation isolates the stress in the connection area from the display areas, preventing stress propagation that would cause glass substrate deformation or chipping while maintaining high substrate utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces heterogeneous interface stress, preventing glass substrate deformation and chipping, thereby enhancing process reliability and yield by converting continuous layers into independent units on the buffer layer.
Implementation Method 1
forming a buffer layer on the glass substrate; forming at least one groove on the buffer layer of the connection area; and forming at least one layer on the buffer layer, and the at least one layer extends into the groove
Data Source
AI summary
A method of manufacturing a display panel and a display panel are provided. A groove is formed on a buffer layer through performing exposure and etching processes, so as to divide the buffer layer into independent units. A gate insulating layer, a dielectric layer, and a passivation layer are converted from continuous layers to independent layers on the buffer layer. Therefore, heterogeneous interface stress accumulated in the independent unit is reduced, it prevents the deformation of the glass substrate, protects the glass substrate, reduces fragmentation phenomenon, and improves process reliability and yield.