Grooved Capacitor Case for Thin Secure Substrate Mounting
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Solution Overview
Problem
The challenge in ultra-slim TV development is reducing the thickness of capacitors and their mounting substrates without compromising capacitance or requiring additional fixing materials.
Innovation Solution
A capacitor design that includes a case with a groove and protrusion structure, allowing it to be inserted and fixed to a substrate hole, eliminating the need for separate fixing processes or materials, and maintaining the capacitor's thickness and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the capacitor is mounted on the substrate using conventional methods, then the capacitor can be fixed to the substrate, but the combined thickness of the substrate and capacitor increases
Solution Approach 1:
The capacitor case is inserted into a hole formed in the substrate, with the groove receiving a substrate protrusion. This nesting arrangement allows the capacitor to be mounted within the substrate thickness rather than adding to it, reducing the combined thickness while maintaining secure fixation through the engagement between the groove and protrusion.
2Reliability
If additional fixing materials are used to secure the capacitor, then the fixing reliability improves, but the device complexity and production cost increase
Solution Approach 1:
The capacitor case includes a groove that directly engages with a protrusion on the substrate, creating a self-fixing mechanism. This groove-protrusion engagement allows the capacitor to be securely mounted without requiring additional fixing materials such as adhesives or fasteners, simplifying the fixing process and reducing device complexity.
3Length of stationary object
If the capacitor structure is simplified to reduce thickness, then the combined thickness decreases, but the structural strength may be compromised
Solution Approach 1:
The case is designed with a groove that provides localized structural reinforcement at the mounting interface. This groove engages with the substrate protrusion to create a strong mechanical connection, while the rest of the case maintains sufficient thickness to preserve overall structural strength and capacitance performance.
Data Source
AI summary
An electronic device including a substrate comprising a hole, and a capacitor capable of being inserted and fixed to the hole of the substrate. The electronic device includes a substrate including a hole, and a capacitor inserted to the hole so as to be mounted on the substrate. The capacitor includes a case provided to accommodate a dielectric therein and forming an exterior of the capacitor, a lead wire connected to the dielectric and extending from an inside of the case to an outside of a first side surface of the case, and a groove recessed on a second side surface of the case opposite to the first side surface and provided to be engaged with a side, which forms a circumference of the hole, of the substrate to allow the case to be inserted and fixed to the hole.