Grooved Carrier Structure for High-Speed Signal Crosstalk Control
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Solution Overview
Problem
Conventional package substrates suffer from significant electrical insertion loss and crosstalk issues due to the formation of ground layers on both surfaces of the dielectric body, which hinder high-frequency and high-speed signal transmission in electronic products.
Innovation Solution
A carrier structure with grooves in the ground layer and guard lines to facilitate noise dispersion, preventing crosstalk by positioning grooves to stagger from conductive vias and using insulating materials in these grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If ground layer is formed on the entire surface of the dielectric body, then shielding effect is improved, but crosstalk between signal lines increases due to noise not spreading out
Solution Approach 1:
The ground layer is segmented by forming grooves that divide it into separate regions. This segmentation allows noise to spread out from the signal lines while maintaining ground shielding in other areas, resolving the contradiction between shielding effect and crosstalk prevention.
Solution Approach 2:
The ground layer has different properties in different regions: areas with grooves allow noise dispersion while areas without grooves maintain shielding. This local differentiation resolves the contradiction by having different ground layer characteristics in different locations.
2Object-affected harmful factors
If ground layer is formed on the entire surface, then noise containment is improved, but signal integrity deteriorates due to increased electrical coupling
Solution Approach 1:
By segmenting the ground layer through grooves, noise containment is maintained in regions where ground is continuous while signal integrity is improved in regions where grooves allow noise dispersion, preventing electrical coupling between signal lines.
Solution Approach 2:
The groove acts as an intermediary structure between the signal lines and the ground layer, allowing noise to spread out while maintaining the overall shielding effect, thus protecting signal integrity without compromising noise containment.
3Loss of energy
If low-loss dielectric material is used, then signal attenuation is reduced, but crosstalk problems persist due to ground layer configuration
Solution Approach 1:
The ground layer segmentation through grooves addresses crosstalk issues independently of the dielectric material properties, allowing low-loss dielectric material to be used while simultaneously preventing crosstalk through the groove structure.
Solution Approach 2:
The ground layer is given different local properties through grooves to prevent crosstalk, while the dielectric material maintains its low-loss characteristics, achieving both signal attenuation reduction and crosstalk prevention.
Data Source
AI summary
A carrier structure is provided, in which a ground layer is formed on a dielectric body, a circuit layer is formed in the dielectric body, and a conductive via is formed in the dielectric body and electrically connected to the circuit layer and the ground layer, where the ground layer has at least one first groove that exposes a surface of the dielectric body, so that the noise of the circuit layer is easy to spread out of the dielectric body, so as to prevent the problem of crosstalk from occurring in the circuit layer.