Grooved Chute Surface for Uniform Cooling in Filament Bonding

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Solution Overview

Problem

Existing methods for manufacturing filament three-dimensional bonded members face challenges in forming uniform cooling water films on chute surfaces, leading to non-uniform filament bonding due to irregular filament movement and reduced adhesive strength at fusing points.

Innovation Solution

The device incorporates chutes with grooves of specific dimensions and orientations on their surfaces to retain cooling water, ensuring uniform film formation and maintaining adhesive strength by controlling the width, depth, and spacing of these grooves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sandblasting treatment is used to roughen the chute surface, then cooling water retention ability is improved, but the uniformity and depth control of recesses deteriorates

Engineering Contradiction:
Improvecooling water retention abilityVSAvoiduniformity of recess depth
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The chute surface is segmented into multiple grooves with specific dimensions (width 0.1-3.0mm, depth 0.1-3mm, spacing 1-7mm) rather than using a uniform roughened surface. This segmentation allows precise control over cooling water retention while maintaining surface uniformity, resolving the contradiction between reliability and manufacturing precision.

Inventive Principle:
Principle #1Segmentation

2Reliability

If cooling water supply amount is increased to form a reliable cooling water film, then filament adherence prevention is improved, but adhesive strength at fusing points deteriorates

Engineering Contradiction:
Improvecooling water film formationVSAvoidadhesive strength at fusing points
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The groove structure creates local cooling water retention zones that concentrate cooling effect where needed (at the chute surface) without requiring excessive cooling water supply. This local quality approach prevents filament adherence at critical points while using minimal cooling water, thus maintaining adhesive strength at fusing points.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If the chute surface is made smoother to reduce friction, then filament movement speed uniformity is improved, but cooling water film formation ability deteriorates

Engineering Contradiction:
Improvefilament movement uniformityVSAvoidcooling water film formation
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

Instead of a completely smooth or completely rough surface, the chute incorporates segmented grooves that create localized cooling water retention without significantly increasing overall surface friction. The grooves are designed with specific dimensions (width 0.1-3.0mm, depth 0.1-3mm) to retain cooling water while maintaining relatively smooth filament passage, resolving the contradiction between movement uniformity and film formation.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for the production of a more uniform filament three-dimensional bonded member without compromising adhesive strength at fusing points, preventing filament adherence and ensuring consistent quality.

Implementation Method 1

a plurality of grooves are formed in an upper surface of the chute inclined plate... cooling water supplied to the chute inclined plate is retained or decelerated by the projections and recesses, and thus a cooling water film W is formed

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

it is likely that a cooling water film to be caused by the surface tension of water flows down while being not formed

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 3

the molten filaments are cooled, and thus adhesive strength at the fusing points of the molten filaments is disadvantageously lowered

Methodology Applied
Scientific EffectThermal cooling: Cooling

Implementation Method 4

fusing contact points thereof... a fusing formation unit that three-dimensionally entangles the molten filaments and simultaneously fuses contact points

Methodology Applied
Scientific EffectThermal bonding: Welding

Data Source

PatentUS20260070276A1Device for manufacturing filament three-dimensional bonded member
Publication Date: 2026.03.12 AIRWEAVE INC
  • US20260070276A1 patent drawing
  • US20260070276A1 patent drawing
  • US20260070276A1 patent drawing

AI summary

In a device for manufacturing a filament three-dimensional bonded member that includes: a molten filament supply unit that discharges a molten filament group downward; a chute that includes a chute inclined plate which receives a molten filament at an end in thickness direction of the group and displaces the group in such a direction as to reduce thickness of the group; a cooling water supply unit that supplies cooling water to the plate; and a fusing formation unit that three-dimensionally entangles molten filaments and simultaneously fuses contact points, grooves are formed in an upper surface of the plate, the width of each of the grooves is 0.1 mm or more and 3.0 mm or less, the depth of each of the grooves is 0.1 mm or more and 3 mm or less and a distance between the adjacent grooves is 1 mm or more and 7 mm or less.