Grooved Circuit Board Layout for Embedded Chip Cooling
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Solution Overview
Problem
Current embedded chip circuit boards face challenges with chip compatibility, high manufacturing costs, and insufficient heat dissipation and layout space due to the use of microvias and expensive materials, especially in miniaturized communication devices.
Innovation Solution
A circuit board design featuring a groove or channel with connection wirings and a heat dissipation block, allowing for electrical and thermal coupling of electronic components without conductive through holes, using general materials to reduce costs and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microvia drilling and plating process is used to electrically connect chip to circuit base, then electrical connection is achieved, but manufacturing cost increases due to expensive equipment and materials
Solution Approach 1:
The patent extracts the electrical connection function from the traditional microvia drilling and plating process. Instead of using expensive microvia technology, the invention uses a groove structure with connection wirings formed on the groove walls and bottom, eliminating the need for microvia drilling equipment and reducing manufacturing costs while maintaining electrical connection reliability
Solution Approach 2:
The patent replaces expensive sintering materials and low thermal expansion coefficient circuit base materials with more economical alternatives. The groove structure allows using standard circuit base materials and conventional wiring materials, significantly reducing material costs while achieving the same electrical connection function
2Reliability
If chip is embedded in circuit base with microvia connection, then electrical connection is established, but heat dissipation performance is insufficient
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional groove embedding. The groove structure provides vertical space for connection wirings to extend from the groove walls and bottom to contact pads on the circuit base surface, enabling better thermal and electrical contact while improving heat dissipation through the additional dimensional space
3Reliability
If traditional embedded chip structure is used, then chip is mounted on circuit base, but layout space is wasted and heat dissipation is insufficient
Solution Approach 1:
The patent embeds the chip and connection wirings within a groove recessed into the circuit base, creating a nested structure. This allows the chip to be housed within the groove volume rather than occupying surface area, effectively utilizing the three-dimensional space of the circuit base and improving layout space efficiency while maintaining connection stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation and saves layout space while reducing manufacturing costs by eliminating the need for expensive materials and enhancing electrical reliability through stable connections.
Implementation Method 1
The heat dissipation block is disposed in the groove, is located between the electronic component and the second surface, and is thermally coupled to the electronic component
Data Source
AI summary
A circuit board includes a circuit base, an electronic component and a heat dissipation block. The circuit base has first and second surfaces, and a groove recessed from the second surface toward the first surface and has first and second side walls, and a bottom part adjacent to the first surface, where the width of the bottom part is smaller than the distance between the first and the second side walls. The circuit base includes first connection wiring and second connection wirings disposed on the first and the second side walls, first and second pads disposed on the bottom part and electrically connected to the first and the second connection wirings. The electronic component is disposed in the groove and is electrically connected to the first and the second connection wirings. The heat dissipation block is disposed in the groove and is thermally coupled to the electronic component.