Grooved Chemical Mechanical Polishing Pad Manufacturing
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Solution Overview
Problem
Conventional methods for manufacturing polishing layers for chemical mechanical polishing pads often result in the formation of stringer defects, density defects, and uneven surface roughness, which can lead to unpredictable polishing performance and reduced pad lifetime.
Innovation Solution
A method involving the creation of an ungrooved polishing surface followed by machining curved and linear grooves in an XY grid pattern using a step-down process, where each successive cutting pass increases the groove depth, and employing a dynamic nozzle movement during material charging to minimize defects and enhance surface smoothness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional single-pass grooving methods are used to manufacture polishing layers, then manufacturing speed is maintained, but stringer defects and surface roughness increase
Solution Approach 1:
The grooving process is segmented into multiple sequential passes instead of a single pass. The method performs a first pass to create initial grooves, then a second pass to refine and smooth the groove surfaces. This segmentation allows each pass to focus on specific aspects of groove formation, reducing surface roughness and eliminating stringer defects while maintaining overall manufacturing efficiency through optimized pass sequencing.
Solution Approach 2:
The first grooving pass performs preliminary shaping of the grooves before the final smoothing pass. By pre-forming the groove structure in the first pass, the second pass can focus exclusively on surface refinement and defect elimination, achieving high surface smoothness without significantly increasing total manufacturing time.
2Duration of action of stationary object
If groove depth is increased to extend pad lifetime, then pad durability improves, but stringer defects become more prevalent
Solution Approach 1:
The grooving process is segmented into multiple sequential passes instead of a single pass. The method performs a first pass to create initial grooves, then a second pass to refine and smooth the groove surfaces. This segmentation allows each pass to focus on specific aspects of groove formation, reducing surface roughness and eliminating stringer defects while maintaining overall manufacturing efficiency through optimized pass sequencing.
Solution Approach 2:
The first grooving pass performs preliminary shaping of the grooves before the final smoothing pass. By pre-forming the groove structure in the first pass, the second pass can focus exclusively on surface refinement and defect elimination, achieving high surface smoothness without significantly increasing total manufacturing time.
3Manufacturing precision
If polishing medium layer thickness is increased to ensure uniform distribution, then polishing uniformity improves, but direct contact between pad and substrate is prevented
Solution Approach 1:
The polishing pad is designed with non-uniform groove characteristics - the groove spacing and depth are optimized to create localized regions of different medium thickness. This allows the polishing medium to be uniformly distributed in areas where it is needed for chemical polishing, while maintaining direct pad-substrate contact in areas where mechanical polishing is required, achieving both polishing uniformity and contact effectiveness.
Data Source
AI summary
A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.