Grooved Coil Component Structure for Insulation and Anchoring
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Solution Overview
Problem
Existing thin film type coil components face issues with poor insulation between coil portions due to residual seed layers, and they lack sufficient fixing force with the support substrate.
Innovation Solution
A coil component design that includes a support substrate with groove portions, a coil portion with an anchor portion embedded in the grooves, and a pattern portion spaced apart from the substrate surface, eliminating the need for a seed layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a seed layer is used in the electroplating process to form the coil portion, then the coil portion can be successfully formed, but poor insulation occurs between coil portions due to residual seed layer
Solution Approach 1:
The invention extracts and removes the harmful seed layer after the electroplating process is completed. The seed layer is completely removed by etching, eliminating the source of insulation problems while the electroplated coil portion remains intact. This resolves the contradiction by removing the problematic element (seed layer) that caused poor insulation.
Solution Approach 2:
The invention introduces an insulating layer as an intermediary between the coil portion and the support substrate. This insulating layer prevents direct contact between the coil portion and any residual seed layer or substrate, ensuring proper insulation. The intermediary layer acts as a barrier that resolves the insulation issue without affecting the coil formation process.
2Reliability
If a seed layer is removed completely to prevent poor insulation, then insulation between coil portions is improved, but fixing force with the support substrate is insufficient
Solution Approach 1:
The invention segments the coil portion structure into distinct functional parts: the electroplated coil portion and a separate anchor portion. The anchor portion is specifically designed to provide mechanical anchoring to the support substrate, while the coil portion maintains electrical insulation. This segmentation allows the anchor portion to provide fixing force without compromising the insulation properties of the coil portion.
Solution Approach 2:
The invention adds a vertical dimension to the fixing mechanism by creating grooves in the support substrate and forming the anchor portion that extends into these grooves. This three-dimensional anchoring structure provides strong mechanical fixation without requiring the seed layer to remain on the surface, thus maintaining insulation while achieving strong bonding.
3Volume of moving object
If the coil portion is formed close to the support substrate surface, then the structure is compact, but insulation cannot be ensured due to seed layer presence
Solution Approach 1:
The invention completely removes the seed layer that would otherwise occupy space between the coil portion and support substrate. By extracting this problematic layer, the design achieves compactness without compromising insulation, as the electroplated coil portion can be formed directly over the insulating layer without seed layer interference.
Solution Approach 2:
The insulating layer serves as a thin intermediary that enables the coil portion to be positioned close to the support substrate while maintaining proper insulation. This thin barrier layer minimizes the vertical distance between components, achieving compactness, while simultaneously preventing electrical breakdown, ensuring reliability.
4Ease of manufacture
If post-process removal of plating resist and seed layer is performed, then the coil portion can be formed, but poor insulation occurs due to remaining seed layer
Solution Approach 1:
The invention converts the potentially harmful residual seed layer into a beneficial anchoring feature. By intentionally designing grooves in the support substrate and forming the anchor portion in these grooves, any seed layer remnants are contained within the grooves, preventing them from causing insulation issues between coil portions while still providing mechanical anchoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents poor insulation between coil portions and secures a strong fixing force with the support substrate, enhancing the overall performance and reliability of the coil component.
Implementation Method 1
the coil portion may be formed by first forming a seed layer having a shape corresponding to the coil portion on one surface of the support substrate, forming a plating resist, and performing an electroplating process
Data Source
AI summary
A coil component includes a support substrate having one surface including at least one groove portion; a coil portion disposed to contact the one surface of the support substrate; and a body embedding the support substrate and the coil portion, wherein the coil portion has an anchor portion disposed in the at least one groove portion, and a pattern portion disposed on the anchor portion and spaced apart from the one surface of the support substrate. A line width of the anchor portion is narrower than a line width of the pattern portion.