Grooved Conductor Press Hole Resin Wrapping Defects
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Solution Overview
Problem
In electronic modules, particularly those used in vehicles, the exposure of rear surfaces of conductors during resin sealing can lead to resin wrapping around the conductors, causing defects and burrs, and affecting the reliability of connections.
Innovation Solution
The electronic module design includes a sealing part with a groove on the rear surface-exposed conductors and press holes or impressions on the sealing part, positioned opposite to the connectors or electronic elements, to prevent the conductors from floating and resin wrapping, thereby enhancing connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the rear surface of the conductor is exposed from the sealing part to improve heat dissipation, then heat dissipation efficiency is improved, but resin wraps around the conductor causing defects
Solution Approach 1:
The groove is formed on the conductor surface before resin sealing, and the press hole/press impression is prepared in advance on the sealing part. These preliminary structures guide the resin flow and constrain the conductor position during sealing, preventing resin wrapping while maintaining heat dissipation effectiveness.
Solution Approach 2:
The conductor surface is segmented into different functional zones: the groove creates a boundary that separates the heat dissipation area from the resin sealing area, allowing resin to be directed away from the conductor rear surface while still permitting thermal contact.
2Manufacturing precision
If the conductor is pressed to prevent resin wrapping, then resin sealing quality is improved, but the conductor floats up on the opposite side causing resin to wrap around
Solution Approach 1:
Pressing is applied locally at specific positions through press holes or press impressions rather than uniform pressing across the entire conductor surface. This localized pressing prevents resin wrapping at critical areas while avoiding excessive force that would cause floating on the opposite side, thus maintaining overall conductor stability.
3Reliability
If resin sealing is performed on exposed conductors, then electrical connection is achieved, but defects and burrs occur affecting connection reliability
Solution Approach 1:
The groove acts as an intermediary structure between the conductor and the resin. It provides a controlled interface that guides resin flow, prevents direct resin wrapping around the conductor edges, and eliminates the formation of defects and burrs while maintaining reliable electrical connection.
Data Source
AI summary
An electronic module has a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; an electronic element 15, 25 provided on a front surface of the rear surface-exposed conductor 10, 20, 30; and a connector 60 configure to connect the rear surface-exposed conductor 10, 20, 30 and the electronic element 15, 25 or two rear surface-exposed conductors 10, 20, 30 each other. A groove 150 is provided on the front surface of the rear surface-exposed conductor 10, 20, 30. The sealing part 90 is provided with a press hole or a press impression 110, 120, 130 used to press the rear surface-exposed conductor 10, 20, 30. In an in-plane direction, a center portion of the press hole or the press impression 110, 120, 130 is provided on the side opposite to the connector 60 or the electronic element 15, 25 with respect to the groove 150.