Grooved Center-Core Coil Structure for Better Heat Dissipation

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Solution Overview

Problem

Existing coil devices, such as surface-mounted inductors, suffer from poor heat dissipation due to inadequate transfer of heat from the coil to the pot core, leading to high temperatures during current flow.

Innovation Solution

A coil device design incorporating a conductor with a winding portion and a core featuring a center core with recessed groove portions filled with high thermal conductivity materials, allowing efficient heat transfer from the winding portion to the core, and optionally including a second core attached to the side wall with cutout portions for leadout wires, enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a coil is housed in a pot core, then the coil structure is compact and stable, but heat dissipation is poor and the coil temperature becomes high

Engineering Contradiction:
Improvecoil structure stabilityVSAvoidcoil temperature
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The center core portion is divided into multiple segments along the winding axis, with groove portions created between these segments. This segmentation allows heat transfer material to be introduced into the groove portions, creating thermal pathways that segment the heat flow from the coil to the core, thereby improving heat dissipation while maintaining structural stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat transfer material is introduced as an intermediary substance into the groove portions of the center core. This material mediates the thermal transfer between the coil and the core, facilitating more efficient heat conduction from the coil winding to the core structure, thus reducing coil temperature while preserving the compact pot core configuration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat transfer material is filled in the center core groove portion, then heat dissipation is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveheat dissipationVSAvoidmanufacturing process
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The groove portions are pre-formed in the center core portion before the heat transfer material is introduced. This preliminary structuring of the core with integrated grooves allows for systematic and efficient filling of the heat transfer material, reducing manufacturing complexity compared to attempting to create similar thermal pathways after core assembly.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly improves heat dissipation by utilizing high thermal conductivity materials to efficiently transfer heat from the winding portion to the core, effectively managing temperature even in configurations prone to heat retention.

Implementation Method 1

a heat transfer material having a high thermal conductivity can be filled in the center core groove portion. The winding portion of the conductor can release heat of the winding portion to the core via the heat transfer material filled in the center core groove portion.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240282506A1Coil device
Publication Date: 2024.08.22 TDK CORP
  • US20240282506A1 patent drawing
  • US20240282506A1 patent drawing
  • US20240282506A1 patent drawing

AI summary

A coil device includes: a conductor including a winding portion; and a core including a center core portion passing inside the winding portion. The center core portion includes an outer peripheral surface contacted with the winding portion and a center core groove portion recessed inward from the outer peripheral surface.