Grooved Display Encapsulation Structure for Moisture Protection
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Solution Overview
Problem
Display devices with increased display areas face challenges in integrating additional functions while maintaining structural integrity and preventing moisture ingress through openings.
Innovation Solution
A display device design featuring grooves and a multi-layered encapsulation structure, including a substrate with polymer and inorganic layers, a planarization layer with organic insulating material, and a thin-film encapsulation layer with inorganic and organic layers, to enhance structural support and moisture protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display area is increased to add more functions, then the functionality and versatility of the display device are improved, but the structural integrity and moisture protection become compromised due to the presence of openings
Solution Approach 1:
The encapsulation layer is segmented into multiple layers (first inorganic encapsulation layer, organic encapsulation layer, second inorganic encapsulation layer) with different properties. Each layer serves specific functions: inorganic layers provide moisture barrier, organic layer provides flexibility and fills grooves. This segmentation allows the system to maintain moisture protection while accommodating openings and additional functions.
Solution Approach 2:
The patent uses composite encapsulation structure combining inorganic and organic materials. The inorganic encapsulation layers (e.g., silicon oxide, silicon nitride) provide excellent moisture barrier properties, while the organic encapsulation layer (e.g., polyimide) provides flexibility and fills the grooves. This composite approach resolves the contradiction between maintaining moisture protection and accommodating structural modifications for additional functions.
2Adaptability or versatility
If grooves are formed in the substrate to support additional functions, then the versatility of the display device is improved, but the structural integrity is compromised
Solution Approach 1:
The encapsulation layers are designed with local quality variations to address the grooves. The organic encapsulation layer specifically fills the grooves formed in the substrate, while the inorganic layers provide continuous barrier coverage. This localized adaptation maintains structural integrity at the groove sites while allowing additional functions to be integrated.
Solution Approach 2:
The multi-layer encapsulation structure is designed beforehand to accommodate and protect the grooves. The organic encapsulation layer is applied to fill the grooves before final encapsulation, providing cushioning and structural support at the groove locations. This prevents structural weakness from propagating while maintaining the ability to integrate additional functions.
3Reliability
If a multi-layered encapsulation structure is implemented to improve moisture protection, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The organic encapsulation layer serves as an intermediary between the inorganic encapsulation layers. It fills the grooves and provides a bonding interface, while the inorganic layers provide the primary moisture barrier. This intermediary approach simplifies the overall structure by using each material type for its optimal function, reducing the need for even more complex multi-layer configurations.
Data Source
AI summary
A display device includes: a substrate that includes an opening and a display area that surrounds the opening; a plurality of grooves formed in the substrate between the opening and the display area; a display element layer on the substrate and that includes a plurality of display elements in the display area; a thin-film encapsulation layer disposed on the display element layer, the thin-film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially stacked; a planarization layer disposed over the plurality of grooves and that includes an organic insulating material, wherein the planarization layer is disposed over the second inorganic encapsulation layer, and the organic encapsulation layer is disposed below the second inorganic encapsulation layer.