Circuit Board Assembly With Grooved Frame Soldering
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Solution Overview
Problem
In high-density electronic device packaging, stacked circuit boards are prone to separation at connection joints due to uneven forces, leading to communication failures or malfunctions.
Innovation Solution
The implementation of second soldering portions on the frame plate, combined with accommodating grooves and through holes, increases the connection points and force between circuit boards and the frame plate, enhancing stability and reducing separation risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple circuit boards are stacked to increase arrangement space, then the arrangement space for battery and functional modules is increased, but the connection points between circuit boards and frame plate are reduced
Solution Approach 1:
The patent transitions from a single-plane connection structure to a three-dimensional connection structure by adding accommodating grooves on the inner wall and outer wall of the frame plate. This multi-dimensional arrangement allows soldering portions to be distributed across different spatial levels and surfaces, increasing the number of connection points without expanding the overall footprint of the frame plate, thus resolving the contradiction between arrangement space and connection points.
2Strength
If the width of frame body is increased to provide more connection points, then the connection force between circuit board and frame plate is increased, but the arrangement space for electronic components is reduced
Solution Approach 1:
Instead of increasing the width of the frame body in the horizontal plane, the patent utilizes the vertical dimension and surface area of the frame plate by creating accommodating grooves on both inner and outer walls. This allows additional soldering portions to be positioned on different surfaces and at different heights, increasing connection force while preserving the horizontal arrangement space for electronic components.
Solution Approach 2:
The accommodating grooves are nested within the frame plate structure, with soldering portions placed inside these grooves on the inner and outer walls. This nested arrangement allows the connection points to be integrated into the existing frame plate geometry without requiring additional external space, thereby increasing connection force while maintaining compact dimensions.
3Ease of manufacture
If circuit board and frame plate are designed separately for ease of manufacture, then manufacturing flexibility is improved, but connection reliability is reduced due to easy separation under uneven force
Solution Approach 1:
The frame plate is segmented into multiple functional regions including inner wall accommodating grooves, outer wall accommodating grooves, and intermediate regions. Each region can be independently designed and manufactured, allowing for flexible production while the multiple segmented connection points distributed across these regions collectively provide enhanced connection reliability that prevents separation under uneven forces.
Solution Approach 2:
The accommodating grooves are pre-formed in the frame plate structure during manufacturing, creating predetermined locations for the soldering portions. This preliminary structuring ensures that when circuit boards are assembled, the connection points are automatically positioned optimally for maximum connection strength, thereby achieving both ease of manufacture and high connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively buffers external forces, maintaining a stable connection between circuit boards and the frame plate, improving reliability and reducing the likelihood of separation during drops or collisions.
Implementation Method 1
The frame plate includes first soldering portions located in an intermediate region, and second soldering portions located on at least one of an outer wall and an inner wall
Data Source
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AI summary
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly is used in the electronic device. The circuit board assembly includes at least a frame plate and circuit boards. The frame plate includes a frame body, first soldering portions, and second soldering portions. The frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole. The first soldering portions are provided in an intermediate region located on the frame body between the inner wall and the outer wall. At least one of the inner wall and the outer wall is provided with accommodating grooves. The accommodating grooves extend along a thickness direction of the frame plate. The second soldering portions are provided in the accommodating grooves and connected to the frame body. Two circuit boards are respectively provided on two opposite sides of the frame plate along the thickness direction. The circuit board includes pads. The first soldering portions and the second soldering portions are soldered to corresponding pads, respectively. The circuit board assembly provided in the embodiments of this application can increase a connection force between the circuit board and the frame plate, and effectively reduce a possibility of separation between the circuit board and the frame plate.