Intermediate Connection Member Structure for Fine-Pitch Wiring Precision
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Solution Overview
Problem
The demand for further miniaturization of electronic equipment and the resulting need for reduced pitch of wiring in intermediate connection members pose challenges, as the thin parts between through holes become prone to peeling or deformation during hole boring.
Innovation Solution
A method for manufacturing an intermediate connection member involves forming grooves on insulating substrates, disposing conductive members within these grooves, and then aligning and bonding the substrates with an insulating layer in between, allowing for precise cutting to expose the ends of the wiring portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pitch between through holes is reduced to achieve further miniaturization, then the wiring density is improved, but the thin insulating parts between through holes become prone to peeling or deformation during hole boring
Solution Approach 1:
The insulating substrate is divided into multiple through holes, each surrounded by insulating parts. By segmenting the structure into discrete through holes with adequate spacing, the patent maintains sufficient insulating material thickness while achieving compact overall dimensions. This segmentation allows independent processing of each through hole region, preventing peeling or deformation in the thin insulating parts.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the insulating parts surrounding each through hole are designed with sufficient thickness locally to prevent peeling, while the overall pitch between through holes is minimized to achieve compact size. This local quality differentiation ensures that critical areas (insulating parts) maintain adequate dimensions for manufacturing precision while the overall structure achieves miniaturization.
2Productivity
If the pitch of wiring is reduced to meet miniaturization demands, then the density of the three-dimensional mounting structure is improved, but the processing difficulty increases due to thinner insulating parts
Solution Approach 1:
The patent performs preliminary actions by precisely designing the pitch and dimensions of through holes and insulating parts before the actual hole boring process. By pre-calculating and pre-setting adequate insulating part thickness in the design stage, the patent ensures that subsequent manufacturing processes can be performed easily without encountering peeling or deformation issues, thus maintaining high processing ease despite reduced wiring pitch.
Solution Approach 2:
The patent optimizes critical parameters such as the pitch between through holes, the thickness of insulating parts, and the diameter of through holes to achieve the desired balance between wiring density and processing ease. By carefully selecting and adjusting these parameters, the patent enables reduced wiring pitch while maintaining sufficient insulating material thickness to prevent manufacturing defects.
Data Source
AI summary
An intermediate connection member includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside, and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.