Grooved Lead Frame Packaging to Prevent Adhesive Overflow
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Solution Overview
Problem
The miniaturization of semiconductor chip packages leads to adhesive overflow and instability of thin, fine-patterned lead frames during manufacturing, due to mechanical or thermal forces.
Innovation Solution
A semiconductor chip package design that incorporates a lead frame with a groove on one side filled with adhesive, where the semiconductor chip is mounted over the groove, preventing adhesive overflow and enhancing lead frame stability. Additionally, a carrier with high thermal conductivity is used to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the area of the chip pad is reduced for miniaturization, then the package size is reduced, but the adhesive overflows from the chip pad
Solution Approach 1:
The chip pad is divided into two functional regions: a first region for mounting the semiconductor chip and a second region for receiving and containing the adhesive. The groove structure on the chip pad surface segments the adhesive placement area, confining the adhesive within the groove during the bonding process and preventing it from overflowing onto surrounding components.
Solution Approach 2:
The groove acts as an intermediary structure between the adhesive and the chip pad surface. It provides a dedicated containment space that mediates the adhesive placement process, allowing the adhesive to be properly positioned and secured without interfering with the miniaturized package dimensions or overflowing to adjacent areas.
2Device complexity
If thin lead frames with fine patterns are used for miniaturization, then the package complexity is reduced, but the lead frames are damaged or deformed by mechanical or thermal force
Solution Approach 1:
The recessed groove structure is prepared in advance on the chip pad surface, creating a protective cavity that cushions the thin lead frame during the bonding process. This pre-formed structural feature absorbs and distributes mechanical and thermal stresses, preventing deformation of the delicate lead frame patterns while maintaining the miniaturized design.
Data Source
AI summary
A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A width of the groove is not greater than a width of the semiconductor chip. A semiconductor chip may be disposed over the groove and affixed to the lead frame through the adhesive in the groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.