Grooved Semiconductor Lid Structure for CTE Warpage Reduction
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Solution Overview
Problem
Warpage and stress occur in semiconductor devices due to mismatched Coefficient of Thermal Expansion (CTE) between different materials during thermal processes, leading to issues like shorting and open circuits.
Innovation Solution
The introduction of a lid with stiffness adjustment grooves that match the profile of the semiconductor device, reducing warpage and enhancing thermal interface material uniformity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a lid is added to cover the semiconductor device, then warpage is reduced and thermal interface material uniformity is improved, but device complexity increases
Solution Approach 1:
The lid acts as an intermediary component between the packaging substrate and the external environment, mediating the mechanical stresses and providing a reference plane that reduces warpage of the underlying semiconductor device assembly
Solution Approach 2:
The lid changes the mechanical parameters of the assembly by adding stiffness and creating a reference plane, thereby altering the warpage characteristics and improving thermal interface material distribution
2Reliability
If stiffness adjustment grooves are introduced in the lid, then thermal interface material adhesion is enhanced and warpage is reduced, but manufacturing complexity increases
Solution Approach 1:
The stiffness adjustment grooves create local variations in the lid structure, concentrating flexibility in specific regions while maintaining overall rigidity, thereby enhancing thermal interface material adhesion at critical locations without compromising the lid's structural function
Solution Approach 2:
The lid is segmented by introducing grooves that divide the continuous structure into regions with different stiffness characteristics, allowing localized adaptation to the semiconductor device profile while simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage, enhances thermal interface material performance, and improves the lifespan and reliability of semiconductor devices.
Implementation Method 1
The lid is disposed on the packaging substrate... reducing warpage
Implementation Method 2
enhances thermal interface material uniformity and adhesion
Data Source
AI summary
A semiconductor device including a package, a lid and a thermal interface material is provided. The package includes a packaging substrate, semiconductor dies and an insulating encapsulation, wherein the semiconductor dies are disposed on and electrically connected to the packaging substrate, and the insulating encapsulation encapsulates the semiconductor dies. The lid is disposed on the packaging substrate, the lid includes a cover portion and foot portion extending from the cover portion to the packaging substrate, wherein the cover portion covers the semiconductor dies and the insulating encapsulation, the foot portion includes foot segments laterally spaced apart from one another, and the foot segments are attached to the packaging substrate. The cover portion of the lid is attached to the package through the thermal interface material.