Grooved Module Cap for Proximity Sensor Crosstalk Reduction

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Solution Overview

Problem

Proximity or time-of-flight sensors face crosstalk issues due to radiation emitted by the source propagating within the sensor package, which can pollute the detector's response and affect accuracy in proximity detection or time-of-flight calculations.

Innovation Solution

Incorporating a module cap with one or more grooves that act as an optical isolator, directing radiation away from the detector to prevent crosstalk by configuring the grooves' surface normals to be angled away from the detector, thereby reducing unwanted photon reflections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a module cap is added to isolate the source and detector, then crosstalk is reduced, but device complexity increases

Engineering Contradiction:
Improvecrosstalk reductionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The module cap is divided into multiple functional regions: a first region with a first surface facing the source, a second region with a second surface facing the detector, and intermediate regions with grooves. This segmentation allows each region to perform specific optical isolation functions, effectively reducing crosstalk while maintaining a compact structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The module cap acts as an intermediary structure between the radiation source and detector. By positioning the cap between these components and configuring its surfaces and grooves, it mediates the optical paths to prevent direct radiation coupling while allowing reflected signals to reach the detector.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If grooves are added to the module cap to direct radiation away, then crosstalk is minimized, but manufacturing complexity increases

Engineering Contradiction:
Improvecrosstalk reductionVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The grooves in the module cap are configured with specific geometric parameters including depth, width, and angular orientation. By optimizing these parameters, the grooves effectively redirect radiation away from the detector while maintaining compatibility with standard manufacturing processes for molded components.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the module cap structure is made more complex to block radiation paths, then crosstalk reduction improves, but the sensor package size increases

Engineering Contradiction:
Improvecrosstalk reductionVSAvoidsensor package volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The module cap utilizes three-dimensional geometric features including angled surfaces and grooves that extend in multiple dimensions. This dimensional approach allows effective radiation blocking and redirection within a compact volume, preventing crosstalk without significantly increasing the overall sensor package size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes crosstalk between the source and detector, enhancing the accuracy and reliability of proximity or time-of-flight sensing by preventing parasitic photon reflections, thus improving the sensor package's performance.

Implementation Method 1

a surface of the isolator has one or more grooves configured to direct a second reflection of the signal away from the detector

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS10473764B2Proximity sensor package having one or more grooves in a module cap
Publication Date: 2019.11.12 STMICROELECTRONICS (RES & DEV) LTD
  • US10473764B2 patent drawing
  • US10473764B2 patent drawing
  • US10473764B2 patent drawing

AI summary

A sensor package may include a source configured to emit a signal, a detector configured to receive a first reflection of the signal, and an isolator disposed between the source and the detector, where a surface of the isolator has one or more grooves configured to direct a second reflection of the signal away from the detector.