Grooved Peripheral Wall Design for Electrical Apparatus Fluid Infiltration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electrical apparatuses in vehicle cabins face issues with fluid infiltration and adhesion to circuit structures due to capillary phenomena, particularly at the interfaces between the case and cover, which can lead to circuit troubles.
Innovation Solution
The design incorporates a groove along the periphery of either the case or cover peripheral walls to prevent fluid infiltration, allowing liquids to flow down and be discharged externally, with features like inclined surfaces and protrusions to enhance drainage and prevent adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a waterproof structure is provided to prevent fluid infiltration, then reliability is improved, but device complexity increases
Solution Approach 1:
The peripheral wall is divided into multiple regions (first region with gap, second region with abutting contact, third region with groove) to differentially address fluid infiltration at various locations, providing targeted protection without comprehensive complex waterproofing
Solution Approach 2:
The groove acts as an intermediary structure that receives and redirects fluid before it can infiltrate the housing space, serving as a passive barrier that simplifies the overall waterproof design
2Volume of moving object
If the case and cover are positioned close to each other to reduce size, then volume is reduced, but fluid infiltration risk increases due to capillary phenomenon
Solution Approach 1:
Different regions of the peripheral wall are given different structural characteristics: the first region has gaps for drainage, the second region has abutting contact for structural integrity, and the third region has grooves for fluid redirection, allowing compact design without uniform fluid infiltration risk
Solution Approach 2:
Instead of trying to completely seal the gap between case and cover, the design inverts the approach by providing controlled gaps in the first region that allow fluid to drain outward, preventing capillary infiltration while maintaining compact dimensions
3Reliability
If a groove is formed in the peripheral wall to prevent fluid infiltration, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The groove needs to be formed only in the third region rather than the entire peripheral wall, reducing manufacturing complexity and precision requirements while still providing effective drip-proof performance at critical locations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses fluid infiltration into the electrical apparatus, minimizing the risk of circuit damage and allowing for versatile mounting options without increasing manufacturing costs.
Implementation Method 1
there are fears that fluids will infiltrate from gaps between a case and cover due to the capillary phenomenon
Implementation Method 2
liquid that has flowed down to the inside of the groove flows down to a section positioned at the very bottom in the direction of gravity
Data Source
AI summary
An electrical apparatus includes a circuit structure, a case provided with a bottom panel and a case peripheral wall, and a cover provided with a cover panel and a cover peripheral wall. At least a part of an inner surface of the cover peripheral wall and an outer surface of the case peripheral wall face one another, thereby forming a housing space and housing the circuit structure within the housing space. A groove is formed in at least one of (i) the entire periphery of the outer surface of the case peripheral wall or (ii) the entire periphery of the inner surface of the cover peripheral wall. This configuration provides a structure that suppresses infiltration of liquid to the inside of the case, and suppresses adhesion of liquid to the circuit structure.