Transparent Substrate with Grooved Resin and Conductive Metal Lines
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Solution Overview
Problem
Existing methods for manufacturing conductive substrates with fine metal lines of 3 μm or less are limited by low conductivity, high defect rates, and difficulties in achieving precise pattern formation due to issues with wet coating, heat compression, and printing techniques, which affect transparency and display quality in applications like touch panels and OLEDs.
Innovation Solution
A manufacturing method involving the formation of a resin pattern layer with grooves, followed by depositing a conductive metal layer with controlled height and angle, and physically removing excess metal using scraping or detaching methods, allowing for a roll-to-roll process and achieving line widths of 0.1 μm to 3 μm with superior conductivity and transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet coating method is used to form conductive patterns, then manufacturing process is simple, but conductivity is low and non-filled regions are generated increasing defect rate
Solution Approach 1:
The conductive pattern is segmented into discrete metal particles arranged in specific configurations (line patterns, grid patterns, or mesh patterns) rather than continuous coating. This segmentation allows each particle to be individually positioned and controlled, ensuring complete groove filling while maintaining high conductivity pathways.
Solution Approach 2:
The invention changes the physical state and size parameters of conductive materials from resin-based coatings to solid metal particles with controlled sizes (0.1-10 μm). By controlling particle size, shape, and arrangement density, the method achieves both high conductivity and complete groove filling without the limitations of wet coating methods.
2Reliability
If metal particles are compressed by applying heat and pressure, then conductive patterns are formed, but pattern deformation occurs reducing precision
Solution Approach 1:
The metal particles are pre-positioned and pre-arranged in the desired conductive patterns within the grooves before final curing. This preliminary arrangement ensures precise pattern formation, and the subsequent curing process locks the particles in place without requiring high heat or pressure that would cause deformation.
Solution Approach 2:
The invention uses a composite structure combining metal particles with a polymer matrix material. The polymer provides structural support and adhesion while the metal particles provide conductivity. This composite approach allows pattern formation without the extreme heat and pressure needed for pure metal compression, preventing pattern deformation.
3Manufacturing precision
If printing method is used with conductive ink, then conductive patterns can be formed, but droplet size must be reduced to nano-size which is practically difficult
Solution Approach 1:
Instead of controlling conductivity through ink droplet size in the vertical dimension, the invention transitions to the horizontal dimension by arranging metal particles in two-dimensional patterns (lines, grids, meshes). This dimensional shift allows precise line width control through particle arrangement rather than requiring nano-scale droplet sizes.
Solution Approach 2:
The invention uses photomasks or stamp structures to copy and transfer precise conductive patterns onto the substrate. This copying mechanism enables accurate pattern replication with controlled line widths without requiring manual control of ink droplet sizes, making the process practically feasible.
4Reliability
If plating method is used to form conductive patterns, then conductivity is improved, but selective plating on grooves is difficult requiring additional polishing steps
Solution Approach 1:
The grooves are pre-filled with metal particles before plating occurs. This preliminary action ensures that metal is present only where needed in the grooves, and the subsequent plating process deposits metal only on exposed surfaces. This prevents the need for selective plating and eliminates the requirement for polishing steps to remove excess metal.
Solution Approach 2:
The conductive metal particles are preliminarily positioned in the grooves before the plating process. This preliminary placement ensures that the plating step only needs to coat the particle surfaces and fill any gaps, rather than requiring selective deposition. The process is then completed without additional polishing, reducing overall complexity.
5Illumination intensity
If line width of conductive pattern is reduced to 3 μm or less, then transparency is improved, but existing methods cannot achieve such fine line width
Solution Approach 1:
The invention changes the controlling parameter for line width from continuous coating thickness to discrete particle size and spacing. By using metal particles with sizes of 0.1-10 μm and controlling their arrangement density, the method achieves precise line widths of 3 μm or less. This parameter change enables fine pattern formation that is not achievable with conventional wet coating or printing methods.
Solution Approach 2:
The invention replaces mechanical coating systems (doctor blades, spray nozzles) with a particle-based self-assembly approach. Metal particles are deposited and arranged to form conductive patterns through controlled aggregation and positioning, enabling fine line width control without the mechanical limitations that prevent conventional methods from achieving 3 μm or less line widths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of transparent substrates with excellent conductivity and transparency, reducing reflection and improving display quality, while also being environmentally friendly and cost-effective by minimizing chemical waste and enabling efficient roll-to-roll processing.
Implementation Method 1
forming a conductive layer by depositing a metal on the resin pattern layer
Data Source
AI summary
The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1 μm to 3 μm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.