Grooved Resin Insulator for Semiconductor Downsizing

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Solution Overview

Problem

Existing semiconductor devices face challenges in downsizing while maintaining insulation between electrodes, particularly in high withstand voltage applications, as increased electrode distance is necessary to ensure insulation, leading to larger device sizes due to potential degradation from air bubbles or metallic foreign objects in the resin case.

Innovation Solution

A semiconductor device design featuring a resin case with resin insulating parts that include grooves between electrodes, allowing for effective insulation without increasing the distance between electrodes, thereby enabling downsizing while maintaining insulation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the distance between electrodes is increased to ensure insulation, then insulation performance is improved, but device size increases

Engineering Contradiction:

Improveinsulation performanceVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The resin insulating part is segmented by forming grooves that divide it into multiple regions. This segmentation creates multiple insulation paths between electrodes, allowing the use of shorter electrode distances while maintaining insulation performance, thus reducing device size without compromising reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Grooves are formed at specific locations on the resin insulating part where insulation is most critical. This local modification enhances insulation performance at key areas without requiring increased overall electrode distance, enabling device downsizing while maintaining necessary insulation levels

Inventive Principle:

Principle #3Local quality

2Reliability

If a resin case is provided between electrodes to achieve insulation, then insulation is achieved, but air bubbles or metallic foreign objects degrade insulating performance

Engineering Contradiction:

ImproveinsulationVSAvoidair bubbles and metallic foreign objects

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The grooves divide the resin insulating part into segmented regions, creating multiple independent insulation paths. This ensures that even if air bubbles or foreign objects are present in one region, insulation is maintained through other paths, improving reliability despite the presence of harmful factors

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The grooves act as intermediary structures that guide and control the resin filling process, helping to eliminate air bubbles during manufacturing. They also serve as channels that can be filled with high-dielectric materials to enhance insulation while preventing foreign object contamination

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11569141B2Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrode

Publication Date: 2023.01.31 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor device includes a first electrode; a second electrode; a resin case surrounding the first electrode and the second electrode; and a resin insulating part made of a material the same as a material of the resin case and covering part of the first electrode and part of the second electrode inside the resin case. The resin insulating part contacts an inner wall of the resin case or is separated from the inner wall of the resin case. A move positioned between the first electrode and the second electrode is formed at the resin insulating part, and thus a space in which the resin insulating part does not exist or a material different from the resin insulating part is provided between the first electrode and the second electrode.