Grooved Shield Film Module Layout for Parasitic Capacitance Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The occurrence of parasitic capacitance between the shield film provided on a shield-film-equipped electronic component and the shield film on the surface of the sealing resin in a module, which leads to performance degradation.
Innovation Solution
A module design where a substrate with a first surface and a first component is used, with at least a part of the first component's surface covered by a first conductive film, and a sealing resin covering the first surface and component. A shield film is applied over the sealing resin, featuring a first shield portion superimposed on the first conductive film and a second shield portion, isolated by a groove that divides the shield film and extends into the sealing resin, ensuring the first shield portion is electrically independent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield film is provided on the outer surface of the sealing resin to prevent noise interference, then shielding effect is improved, but parasitic capacitance occurs between the shield film on the electronic component and the shield film on the sealing resin
Solution Approach 1:
The shield film on the sealing resin is segmented into multiple independent shield portions by grooves. Each shield portion is electrically isolated from others, preventing parasitic capacitance formation while maintaining shielding effectiveness against noise interference.
Solution Approach 2:
The harmful electrical connection between adjacent shield film portions is extracted by introducing grooves that physically separate and electrically isolate these portions. This removes the parasitic capacitance pathway while preserving the shielding function.
2Adaptability or versatility
If the shield film on the electronic component is used as an interconnection rather than being grounded, then design flexibility is improved, but potential difference occurs between shield films causing parasitic capacitance
Solution Approach 1:
The shield film structure is segmented into electrically independent portions. This allows each portion to serve different functions (grounding or interconnection) without creating unwanted electrical connections, eliminating parasitic capacitance while maintaining design flexibility.
3Ease of manufacture
If the shield film has non-zero resistivity to be manufacturable, then manufacturing feasibility is improved, but noise signal cannot completely flow away causing potential variation
Solution Approach 1:
The shield film is divided into multiple independent portions through grooves. This segmentation allows each portion to be manufactured with practical resistivity values while the overall structure maintains effective noise shielding through distributed grounding points and reduced parasitic effects.
Data Source
AI summary
A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.