Grooved Transfer Substrate for Micro-LED Chip Alignment
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Solution Overview
Problem
The productivity of micro-LED display devices decreases as the size of micro-LEDs decreases and the size of displays increases, due to difficulties in transferring micro-LEDs using conventional pick and place methods, particularly in high pixel density applications like wearable displays.
Innovation Solution
A micro semiconductor chip transferring structure is developed, featuring a transfer substrate with grooves that accommodate micro semiconductor chips, where the minimum space between adjacent chips is 100% to 200% of the chip width, and the grooves are designed to facilitate easy movement and alignment, allowing for efficient transfer and alignment of multiple chips in a wet assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional pick and place method is used to transfer micro-LEDs, then transfer process can be performed, but productivity decreases as micro-LED size decreases and display size increases
Solution Approach 1:
The transfer substrate is divided into multiple grooves, each capable of holding individual micro-LED chips. This segmentation allows parallel transfer of multiple chips simultaneously, dramatically improving productivity compared to sequential pick-and-place methods.
Solution Approach 2:
A transfer substrate with grooves is introduced as an intermediary carrier to hold and transport multiple micro-LED chips. This mediator enables batch transfer operations, reducing the complexity and time of individual chip placement while maintaining precise positioning.
2Productivity
If minimum space between adjacent micro semiconductor chips is 100% to 200% of chip width, then transfer efficiency is improved, but area occupied by chips decreases
Solution Approach 1:
The groove structure adds a vertical dimension to the transfer system, with grooves extending below the chip level. This allows chips to be positioned in grooves without requiring excessive horizontal spacing, as the groove walls provide lateral containment and alignment.
Solution Approach 2:
The groove geometry is locally optimized with specific width and depth dimensions that match the chip characteristics. The groove width is designed to be slightly larger than the chip width, providing just enough space for easy insertion while maintaining tight spacing between adjacent chips in the array.
3Manufacturing precision
If grooves are designed to accommodate micro semiconductor chips with easy movement, then alignment precision is improved, but groove size increases
Solution Approach 1:
The grooves are designed with dimensions that allow dynamic adjustment of chip position during the transfer process. The groove width and depth are optimized to provide guidance and alignment while permitting easy insertion and movement of chips into their final positions.
Solution Approach 2:
The groove dimensions are carefully controlled with specific width-to-depth ratios that optimize both alignment precision and chip accessibility. By adjusting these geometric parameters, the system achieves high positioning accuracy without requiring excessively large groove volumes.
Data Source
AI summary
Provided are a micro semiconductor chip transferring structure and a display device employing a display transferring structure. A transferring structure includes a transfer substrate having a plurality of grooves, and a plurality of micro semiconductor chips transferred to the plurality of grooves, respectively, wherein a minimum space between adjacent two of the plurality of micro semiconductor chips transferred to the plurality of grooves is 100% to 200% inclusive of a width of each of the plurality of micro semiconductor chips.