Semiconductor devices and methods of manufacturing semiconductor devices
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
A method for manufacturing semiconductor devices involving the use of a substrate with grooves and a resin, where a floating pad is defined between grooves, and electronic components are connected via this pad, with layers formed through etching and plating processes to enhance electrical connections and packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing cost is reduced, but package size becomes too large and reliability decreases
Solution Approach 1:
The substrate is divided into multiple segments including first and second grooves that create distinct regions. The floating pad is segmented and positioned between the grooves, allowing independent optimization of different package regions for size reduction while maintaining reliability through structured segmentation of electrical connection paths
Solution Approach 2:
The floating pad is positioned in a three-dimensional space between the first and second grooves, utilizing vertical and lateral positioning to reduce overall package footprint. The grooves create depth variation in the substrate, enabling compact arrangement of electrical connections without compromising signal integrity or reliability
2Productivity
If conventional semiconductor packaging methods are used, then manufacturing process is simple, but performance is relatively low
Solution Approach 1:
The package structure is segmented into distinct functional regions defined by the first and second grooves, with the floating pad occupying the space between them. This segmentation enables optimized electrical connection paths and improves device performance while maintaining manageable manufacturing complexity through modular structure design
Solution Approach 2:
The floating pad is specifically positioned between the grooves to provide enhanced local electrical connectivity. This localized optimization of electrical connection quality in the region between grooves improves overall device performance without requiring complex changes to the entire package structure
3Reliability
If conventional semiconductor packaging methods are used, then manufacturing cost is controlled, but electrical connectivity is insufficient
Solution Approach 1:
The floating pad serves as an intermediary electrical connection element positioned between the first and second grooves. This intermediary structure provides enhanced electrical connectivity between different substrate regions, improving signal transmission and reliability while maintaining cost-effective manufacturing through a relatively simple added component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package size, enhances electrical connectivity, and improves reliability and performance while minimizing costs.
Implementation Method 1
a resin in the first groove
Implementation Method 2
a first groove at the second side of the substrate... a second groove at the first side of the substrate
Implementation Method 3
a floating pad at the first side of the substrate... an upper layer on the first side of the substrate
Data Source
AI summary
In one example, an electronic device comprises a substrate comprising a first side and a second side opposite the first side, wherein the substrate comprises a first groove at the second side of the substrate, a first electronic component over the first side of the substrate, and a resin in the first groove. The substrate comprises a floating pad at the first side of the substrate, a second groove at the first side of the substrate, and a third groove at the first side of the substrate, wherein the floating pad is between the second groove and the third groove. Other examples and related methods are also disclosed herein.