Grooved Electronic Substrate for Thermal Stress Relief

The invention applies local quality by providing groove portions only at specific locations where bumps are positioned, rather than uniformly across the entire substrate surface. This localized approach allows the substrate to accommodate thermal expansion differences while maintaining connection strength at critical bonding points. The groove portions are strategically placed to store bump tip portions, providing reinforcement exactly where needed without the drawbacks of widespread resin packing.

The groove portions act as intermediary structures between the bumps and the substrate surface. These grooves store the bump tip portions and facilitate reliable electrical connection while accommodating thermal stress. The electrode portions within the grooves serve as mediators that maintain electrical connectivity despite thermal expansion differences, effectively decoupling the mechanical stress from the electrical connection function.

The invention merges the connection reinforcement function into the substrate structure itself through the groove portions, eliminating the need for separate resin packing steps. The groove portions are formed as an integral part of the substrate during substrate manufacturing, combining the substrate formation and connection reinforcement functions into a single manufacturing process. This integration removes the additional steps of resin application and curing that would otherwise be required.

The groove portions are prepared in advance during substrate manufacturing, before the electronic components are mounted. This preliminary action of forming the grooves and positioning the electrodes eliminates the need for post-mounting resin packing operations. The substrate is pre-configured with the necessary structural features to reinforce connections, allowing components to be mounted directly without subsequent reinforcement steps.