Thin Circuit Board Grooved Support Base

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Solution Overview

Problem

Thin package structures with a thickness less than 300 μm are prone to warping or deformation during treatment, testing, and transportation due to lack of mechanical strength, leading to potential damage and processing issues.

Innovation Solution

A method involving a support plate with grooves and a releasing material layer is used to form a support base under the thin circuit board, enhancing mechanical strength by forming notches and removing the central part of the support plate to create a stable base.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the thickness of the package structure is reduced to less than 300 μm, then the package structure achieves thinness and compactness, but the mechanical strength decreases causing warping and deformation during treatment, testing, and transportation

Engineering Contradiction:

ImprovethicknessVSAvoidmechanical strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The support plate is segmented into a rim portion and a central portion through groove formation. The rim portion is retained to provide mechanical support while the central portion is removed to achieve thinness. This segmentation allows the package to be thin yet maintain structural strength at critical locations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support plate has different properties in different regions: the rim portion retains full thickness to provide mechanical strength and support, while the central portion is removed to achieve thinness. This local differentiation of material presence allows simultaneous achievement of thinness and strength where needed.

Inventive Principle:

Principle #3Local quality

2Strength

If grooves are formed on the support plate to create a support base, then the mechanical strength is enhanced, but the device complexity increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

Grooves are pre-formed on the support plate before the thinning process. This preliminary action defines the future support base structure, guiding subsequent material removal and ensuring the rim portion maintains its structural integrity while the central portion is removed.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The groove structure acts as an intermediary element that transitions the support plate from a solid disk to a rim-based support base. The grooves define the boundary between retained and removed material, facilitating the transformation while maintaining structural coherence.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS9351409B2Method of manufacturing a thin support package structure

Publication Date: 2016.05.24 KINSUS INTERCONNECT TECH

AI summary

A method of manufacturing a thin support package structure includes the steps of: preparing a support plate formed with a plurality of grooves adjacent to an outer rim thereof, forming a releasing material layer on the support plate; forming a first circuit layer on the releasing material layer so as to form a thin circuit board; forming a dielectric layer on the releasing material layer; forming a plurality of openings in the dielectric layer; forming a second circuit layer on the dielectric layer; forming connection plugs by filling the openings; forming a solder mask on the dielectric layer; forming a plurality of notches on the lower surface of the support plate to communicate with the grooves, respectively; and removing the central part of the support plate between the notches and the central part of the releasing material layer on the support plate.