Ground Clip Spring Fingers for Thin Device Electrical Coupling
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Solution Overview
Problem
The challenge in electronic devices with reduced profiles is the difficulty in fabricating and ensuring reliable electrical connections between ground planes due to space constraints, as existing methods like conductive fabrics and adhesives are time-consuming, lose effectiveness over time, and are limited by thickness, leading to manufacturing tolerance issues.
Innovation Solution
An electrically conductive ground clip with spring fingers is used to securely attach to the device, providing a conduction path between ground planes by passing through openings in the planes, adapting to manufacturing tolerances and reducing electromagnetic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive fabrics, foams and/or adhesives are used to connect ground planes, then electrical conduction is achieved, but the connection loses effectiveness over time and requires time to set or cure
Solution Approach 1:
The patent replaces chemical bonding mechanisms (adhesives, foams) with a mechanical spring-finger system that provides immediate electrical contact. The spring fingers make direct physical contact with ground plane contact pads, eliminating the need for curing time and providing immediate, reliable electrical connection without degradation over time.
Solution Approach 2:
The spring fingers are designed to be elastically deformable, allowing them to dynamically adapt to manufacturing tolerances and maintain consistent contact force. This dynamic capability ensures reliable electrical connection while accommodating variations in assembly, preventing the connection from losing effectiveness over time.
2Reliability
If conductive fabrics, foams and/or adhesives are used to connect ground planes, then electrical conduction is achieved, but manufacturing tolerance issues arise due to thickness restrictions
Solution Approach 1:
The spring fingers are designed with elastic properties that allow them to accommodate manufacturing tolerance variations in the thickness of ground planes and contact pads. The spring mechanism can compress or extend within a range, maintaining reliable electrical contact despite variations in assembly dimensions without requiring precise thickness control.
Solution Approach 2:
The patent changes the physical state of the connection from a rigid, fixed-thickness medium (adhesive, foam) to a dynamically adjustable spring mechanism. The spring fingers can vary their length and contact force, adapting to manufacturing tolerances and eliminating the strict thickness requirements that plague adhesive-based solutions.
3Volume of moving object
If ground planes are electrically coupled in thin-profile devices, then space is saved, but electrical connections become more difficult to fabricate and less reliable
Solution Approach 1:
The ground clip is segmented into multiple spring fingers that can independently contact different ground plane contact pads. This segmentation allows the single ground clip component to establish multiple electrical connections simultaneously, simplifying the manufacturing process while maintaining reliable electrical coupling in the thin device profile.
Solution Approach 2:
The ground clip serves multiple functions: it provides mechanical support, establishes electrical connections between ground planes, and accommodates manufacturing tolerances. This multi-functionality reduces the number of separate components needed, simplifying fabrication while maintaining reliability in the constrained thin-profile environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents ground planes from floating and generating noise, ensuring reliable electrical coupling and reducing electro-static discharge, while accommodating the thin profiles of mobile devices.
Implementation Method 1
A ground clip may include a base portion to secure the ground clip to the device and a plurality of spring fingers, each of the spring fingers to contact and electrically couple to one of the ground planes
Implementation Method 2
an electrically conductive ground clip configured to contact each of the ground planes to prevent these metal planes from floating and functioning as antennas which can generate electromagnetic noise
Data Source
AI summary
Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.