Ground Element Shielding for RF Coupling in Modular Devices

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Solution Overview

Problem

High-frequency electronic signals in mobile communication devices cause unwanted RF coupling between connectors and antennas, leading to desensitization and interference, which affects data transfer rates.

Innovation Solution

A modular device system with a ground element adjacent to the antennas and a multi-pin connector array, where the ground element is grounded to the chassis and positioned between the antennas and the connector array, and a metal bar (debar) is used to separate the connector array from the antennas, providing additional shielding through pogo pins and a metal plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If high-frequency signals are used to increase data rates, then device response time is improved, but RF coupling between connectors and antennas increases causing desensitization

Engineering Contradiction:
Improvedata rateVSAvoidRF coupling interference
Core Design Contradiction:
SpeedVSObject-affected harmful factors

Solution Approach 1:

A ground element is introduced as an intermediary component positioned between the connector array and the antenna. This ground element acts as a mediator that blocks RF coupling paths, preventing harmful interference from reaching the antenna while allowing the high-frequency signals to maintain their data transmission function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The device structure is segmented by introducing a ground element that divides the space between the connector array and the antenna into separate zones. This segmentation creates distinct electromagnetic environments, isolating the high-frequency connector signals from the antenna signals to prevent mutual interference.

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If connectors are placed close to antennas for compact design, then device size is reduced, but signal interference increases

Engineering Contradiction:
Improvedevice sizeVSAvoidsignal interference
Core Design Contradiction:
Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The ground element serves as a mediator that enables close placement of connectors and antennas while preventing harmful RF coupling. It blocks the interference paths between these components, allowing compact device design without sacrificing signal integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The ground element provides localized electromagnetic shielding specifically in the region between the connector array and the antenna. This local quality enhancement creates a protected zone that prevents interference while maintaining the overall compact device structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces interference and desense, improving antenna system isolation and maintaining signal integrity by increasing the signal-to-noise ratio and reducing data transfer throttling.

Implementation Method 1

coupling between high-frequency lines or connectors and nearby antennas also increases

Methodology Applied
Scientific EffectRF coupling: Electromagnetic Induction

Data Source

PatentUS9799947B1Modular device system desense reduction
Publication Date: 2017.10.24 MOTOROLA MOBILITY LLC
  • US9799947B1 patent drawing
  • US9799947B1 patent drawing
  • US9799947B1 patent drawing

AI summary

A modular device system is provided having a base portable electronic communication device. The base portable electronic communication device has a display side and a reverse side, and one or more antennas being located along one of the device edges. A ground element on the reverse side of the housing is adjacent to the antennas and is grounded to the chassis. A multi-pin connector array on the same side is located adjacent to the ground element and the ground element lies between the connector array and the antennas. The ground element is configured to contact a mating ground element on an add-on module when the module is mated to the base portable electronic communication device.