Ground Inlays for Shielded Receptacle Contact Modules
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Solution Overview
Problem
Conventional orthogonal connectors in midplane connector systems face limitations in contact density and signal integrity, with complex and expensive routing of signals leading to potential signal degradation, and challenges in implementing effective electrical shielding.
Innovation Solution
The implementation of a receptacle assembly with a stacked configuration of contact modules, including a tray with ground inlays and a frame assembly, where the ground inlays provide electrical shielding by extending ground slats and flanges between differential pairs of signal contacts, enhancing contact density and signal integrity through 360° shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional orthogonal connectors are used with 90° rotation in midplane assembly, then signal routing is achieved, but contact density is limited and routing becomes complex and expensive
Solution Approach 1:
The patent transitions from planar 2D contact arrangements to a three-dimensional stacked configuration. Multiple contact modules are arranged vertically in stacks, with contact modules positioned at different heights (e.g., first contact module at a first height, second contact module at a second height). This vertical stacking enables significantly higher contact density within the same footprint area while simplifying the routing architecture by reducing the need for complex lateral signal paths through the midplane.
Solution Approach 2:
The connector is divided into multiple discrete contact modules, each containing a subset of the total contacts. These modular units can be independently manufactured, tested, and assembled. The segmentation allows for optimized signal routing within each module and reduces the overall routing complexity by breaking down the large-scale complex routing problem into smaller, manageable modular units that can be stacked vertically.
2Reliability
If electrical shielding is implemented in conventional orthogonal connectors, then signal integrity improves, but implementation becomes difficult and expensive
Solution Approach 1:
The shielding function is merged with the structural support function by integrating ground contacts directly into the contact module structure. The ground contacts are positioned to surround and shield signal contacts laterally, while also serving as structural elements of the module. This integration eliminates the need for separate shielding components and reduces manufacturing complexity.
Solution Approach 2:
Ground contacts are strategically positioned in specific locations around signal contacts to provide localized shielding where it is most needed. The ground contacts are arranged to surround signal contacts laterally and position ground elements between adjacent signal contacts, creating targeted electromagnetic shielding zones. This localized approach provides effective signal integrity protection while minimizing the amount of shielding material and manufacturing complexity compared to complete 360° shielding.
3Quantity of substance
If contact density is increased in conventional connectors, then more signals can be routed, but signal degradation increases due to complex routing
Solution Approach 1:
By arranging contact modules in vertical stacks with multiple heights, the patent increases contact density without extending lateral signal paths through the midplane. Signals travel shorter vertical distances within stacked modules rather than long horizontal paths across the midplane, reducing signal degradation while accommodating more contacts in the same footprint.
Solution Approach 2:
The combination of ground contacts and signal contacts within the same contact modules creates integrated shielded signal paths. The ground contacts surrounding and adjacent to signal contacts provide localized electromagnetic shielding that maintains signal integrity even as contact density increases, preventing cross-talk and interference that would otherwise occur in high-density configurations.
Data Source
AI summary
A receptacle assembly includes a receptacle housing and a contact module received in the housing. The contact module includes a tray having a cavity defined by inner surfaces of the tray. Ground inlays are received in the cavity along corresponding inner surfaces. The ground inlays have ground slats and ground flanges extending from the ground slats. A frame assembly is received in the cavity of the tray between the ground inlays. The frame assembly is electrically shielded by the ground inlays and has a plurality of receptacle signal contacts arranged in differential pairs carrying differential signals. The ground slats extend along opposite sides of corresponding pairs of the receptacle signal contacts and the ground flanges extend between pairs of the receptacle signal contacts.