Ground Isolation Planes for Horizontal Data Signal Crosstalk Reduction

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Solution Overview

Problem

Current semiconductor package devices face challenges in providing stable and clean power, as well as high-frequency data signal transmission between IC chips, due to signal crosstalk and inadequate electrical isolation of horizontal data signal transmission lines.

Innovation Solution

Incorporating ground isolation planes and coaxial ground isolation lines surrounding horizontal data signal transmission lines to electrically shield and isolate the signals, reducing crosstalk and increasing electrical isolation, and tuning the signal line widths and ground isolation line widths for optimal data transmission performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If horizontal data signal transmission lines are routed through package devices without adequate isolation, then device complexity is reduced and manufacturing is simplified, but signal crosstalk increases and electrical isolation deteriorates

Engineering Contradiction:

Improvesignal qualityVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Ground isolation planes and coaxial ground isolation lines are introduced as intermediary elements between adjacent horizontal data signal transmission lines. These ground structures act as mediators that provide electrical isolation and shield against signal crosstalk, thereby improving signal quality without requiring fundamental changes to the transmission line routing architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The package device is segmented into distinct isolation regions by inserting ground planes and coaxial ground lines between adjacent signal transmission lines. This segmentation creates electrically isolated channels for each data signal, preventing crosstalk while maintaining the overall package structure integrity and enabling high-frequency operation up to 25 gigatransfers per second.

Inventive Principle:

Principle #1Segmentation

2Reliability

If ground isolation planes and coaxial ground isolation lines are added to isolate horizontal data signal transmission lines, then electrical isolation and signal stability improve, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improveelectrical isolationVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The ground isolation planes and coaxial ground isolation lines are merged with the existing power delivery network and signal transmission line structures in the package device. By integrating these isolation elements into the established manufacturing framework rather than adding separate processing steps, the electrical isolation performance is enhanced while minimizing increases in manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Speed

If signal line widths and ground isolation line widths are tuned for optimal performance, then data transmission frequency and signal stability increase, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata transmission frequencyVSAvoidline width control

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The widths of signal lines and ground isolation lines are optimized as key parameters to achieve optimal impedance matching and minimize signal reflections at high frequencies. By carefully controlling these dimensional parameters during the manufacturing process, the package device achieves stable data transmission at frequencies up to 25 gigatransfers per second, with the ground isolation structures providing consistent electrical performance across manufacturing variations.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the stability and cleanliness of high-frequency data signals, increases the usable frequency range up to 25 gigatransfers per second, and improves copper density and power delivery network impedance in package devices.

Implementation Method 1

Incorporating ground isolation planes and coaxial ground isolation lines surrounding horizontal data signal transmission lines to electrically shield and isolate the signals

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10580734B2Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices

Publication Date: 2020.03.03 INTEL CORP

AI summary

A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground planes between and such ground isolation lines surrounding horizontal data signal transmission lines (e.g., metal signal traces) that are horizontally routed through the package device. The (1) ground isolation planes between, and/or (2) ground isolation lines electrically shield the data signals transmitted in signal lines, thus reducing signal crosstalk between and increasing electrical, isolation of the data signal transmission lines. In addition, data signal transmission lines may be tuned using eye diagrams to select signal line widths and ground isolation line widths that provide optimal data transmission performance. This package device provides higher frequency and more accurate data signal transfer between different horizontal locations of the data signal transmission lines, and thus also between devices such as integrated circuit (IC) chips attached to the package device.