Electronic Device Module Ground Pad Air Path Design
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Solution Overview
Problem
In electronic device modules, gas trapped during the soldering process can lead to voids in the cured conductor, causing reliability issues under physical or environmental stresses, such as moisture and thermal impacts, which may result in joint breakage.
Innovation Solution
The electronic device module features a substrate with a ground region and air paths between ground pads, allowing gas generated during the mounting process to be discharged, and a manufacturing method involving a conductive paste applied through a printing mask with specific openings to ensure efficient gas discharge and bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a large area pad is used for bonding in the soldering process, then bonding strength is improved, but gas discharge becomes difficult and voids form in the cured conductor
Solution Approach 1:
The ground region is divided into multiple ground pads spaced apart from each other, creating multiple discharge paths for gas during the soldering process. This segmentation allows gas to escape through the spaces between pads rather than being trapped under a single large pad, thereby preventing void formation while maintaining adequate bonding strength through the distributed pad structure.
2Reliability
If ground pads are spaced apart to allow gas discharge, then void formation is reduced, but bonding area is decreased
Solution Approach 1:
The ground region is segmented into multiple ground pads that are spaced apart to create gas discharge paths. This segmentation strategy achieves both objectives: the spaced pads provide multiple bonding areas distributed across the ground region while simultaneously creating channels for gas to escape during soldering, thus preventing void formation without sacrificing total bonding area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces defects in the soldering process by ensuring smooth gas discharge, enhancing bonding reliability between the electronic device and the substrate.
Implementation Method 1
performing a reflow process to melt and cure the conductive paste
Implementation Method 2
performing a reflow process to melt and cure the conductive paste
Implementation Method 3
an air path provided between the ground pads, through which gas generated during a process of mounting the electronic device on the substrate is discharged
Data Source
AI summary
An electronic device module includes a substrate having a ground region including ground pads spaced apart from each other, an electronic device mounted on the substrate and including a ground terminal bonded to the ground region, and a conductive adhesive bonding the ground pads and the ground terminal together, wherein an upper surface of the conductive adhesive includes a bonding surface bonded to the ground terminal, and a lower surface of the conductive adhesive includes bonding surfaces bonded to each of the ground pads, and an air path provided between the ground pads, through which gas generated in a process of mounting the electronic device on the substrate is discharged.