Redistribution Layer Ground Pad Extensions for Crosstalk Suppression
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Solution Overview
Problem
Existing semiconductor devices face challenges in mitigating electromagnetic crosstalk between conductive lines due to design rule limitations on ground vias, which restrict signal bandwidth.
Innovation Solution
Incorporating ground pad extensions in through layer via elements to suppress electromagnetic crosstalk by aligning them at a radial distance of λ/8 from aggressor and victim signal carrying elements, reducing resistance without compromising the semiconductor device's form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If more ground vias are added to suppress crosstalk, then crosstalk mitigation improves, but space for signal-carrying lines decreases, limiting bandwidth
Solution Approach 1:
The patent extends ground contact pads vertically into through-silicon vias (TSVs) that penetrate multiple redistribution layers, transitioning from a planar 2D ground shield approach to a 3D vertical ground connection approach. This dimensional change allows ground vias to suppress crosstalk across multiple layers without consuming additional lateral space, thereby maintaining signal bandwidth while improving crosstalk suppression.
Solution Approach 2:
The patent nests ground contact pads within through-silicon via structures that pass through multiple redistribution layers and substrate layers. The ground TSVs are positioned between aggressor and victim signal lines in a nested configuration, where the ground structure is contained within the vertical stack of layers, maximizing space utilization and crosstalk suppression simultaneously.
2Object-affected harmful factors
If ground vias are positioned between signal lines to reduce crosstalk, then electromagnetic interference decreases, but design rule constraints limit the number of ground vias that can be added
Solution Approach 1:
By transitioning to vertical through-silicon via ground connections that penetrate multiple layers, the patent circumvents planar design rule constraints. The vertical dimension allows ground TSVs to be positioned between signal lines in three-dimensional space without violating two-dimensional layout design rules, enabling effective crosstalk suppression while maintaining design rule compliance.
3Reliability
If the number of ground vias is increased to suppress crosstalk, then signal integrity improves, but the space available for signal-carrying lines is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by implementing through-silicon via ground connections that extend through multiple redistribution layers. This allows ground structures to provide signal integrity protection without occupying additional lateral space, thereby maintaining area availability for signal-carrying lines while improving signal integrity through enhanced ground shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses electromagnetic crosstalk while maintaining signal density and bandwidth, adhering to design rules.
Implementation Method 1
Incorporating ground pad extensions in through layer via elements to suppress electromagnetic crosstalk by aligning them at a radial distance of λ/8 from aggressor and victim signal carrying elements
Data Source
AI summary
A semiconductor device with first and second portions of a redistribution layer with arrays of through via elements carrying electrical ground connections that includes one or more contact pads that have one or more extensions projecting therefrom into a null space between through via elements carrying electrical signals. A method of manufacturing the semiconductor device is also disclosed.