Ground Plane Orientation for Noise Reduction in Medical Devices
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Solution Overview
Problem
Electronic devices, particularly hearing prostheses, face noise and interference issues due to varying magnetic fields that induce eddy currents, affecting signal quality and power efficiency in electromagnetic RF links.
Innovation Solution
Configuring electrical components and ground planes to be substantially parallel to the varying magnetic field, reducing magnetic flux and noise interference by providing a path for current pulses to flow to the ground, thus improving signal quality and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electrical components are configured perpendicular to the varying magnetic field to maximize signal reception, then signal strength is improved, but noise and interference from eddy currents increase
Solution Approach 1:
The patent changes the orientation parameter of electrical components and ground planes from perpendicular to parallel with respect to the varying magnetic field. This parameter change reduces magnetic flux through the components, thereby decreasing eddy currents and associated noise while maintaining adequate signal reception through optimized component placement and shielding strategies.
Solution Approach 2:
The patent introduces ground planes as intermediary elements that are configured parallel to the varying magnetic field. These ground planes serve as mediators that provide controlled paths for eddy currents, preventing them from flowing through sensitive electrical components. The ground planes act as sacrificial conductors that protect other components from noise and interference.
2Object-affected harmful factors
If ground planes are added to provide current paths, then noise reduction is improved, but device complexity increases
Solution Approach 1:
The patent merges the ground plane functionality with the existing substrate structure. Instead of adding separate ground plane components, the ground planes are integrated directly into the substrate layers, combining the substrate's mechanical support function with the ground plane's electromagnetic shielding function. This integration reduces device complexity while maintaining noise reduction benefits.
Solution Approach 2:
The patent makes the substrate serve multiple functions: it provides mechanical support for electrical components and simultaneously functions as a ground plane for noise reduction. This multi-functionality eliminates the need for separate ground plane structures, thereby reducing device complexity while achieving effective noise mitigation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes noise and interference, enhancing signal quality and power efficiency in electronic devices operating within varying magnetic fields.
Implementation Method 1
a varying or alternating magnetic field that can induce undesirable eddy currents in the electronic device
Implementation Method 2
induce undesirable eddy currents in the electronic device
Implementation Method 3
decreasing a magnetic flux of the magnetic field that passes through the components and electrical conductive parts
Data Source
AI summary
An external device of an implantable medical system includes a coil that is substantially disposed in an XY-plane. When a first AC electrical signal is passed through the coil, the coil generates an alternating magnetic field that represents the AC electrical signal. The electrical signal can include at least one of power or data. The device also includes a cylindrical shaped permanent magnet with base substantially parallel to the XY-plane. The magnet can be is used to position the external device with respect to an implantable device. Further, the device has a printed circuit board that includes at least a portion that is substantially orthogonal to the XY-plane and the portion can also include an electrical ground plane. In addition, the device can include at least one sensor that is coupled to the portion of the substrate and to the ground plane.